Panel structure and making method thereof

Abstract

The invention discloses a panel structure and a making method thereof; the panel structure comprises a soft substrate, a particle complex carbon film release film and an element layer; the particle complex carbon film release film is positioned on a first surface of the soft substrate, comprises a plurality of particles, wherein the surface of each particle is provided with the carbon film; the element layer is positioned on a second surface, opposite to the first surface, of the soft substrate; the particle complex carbon film release film comprises a plurality of particles, so wet-type coating method can be used for formation, and film thickness and uniformity can be more easily controlled, so technology is simple, and technology time is short.

Description

technical field [0001] The present invention relates to a panel structure and a manufacturing method thereof, and in particular to a panel structure with a granular composite carbon film release layer and a manufacturing method thereof. Background technique [0002] With the rapid development of display technology, the display has gradually developed from the early cathode ray tube (cathode ray tube, CRT) display to the current flat panel display (FPD). Compared with flat-panel displays made of hard substrates (such as glass substrates), flexible substrates (such as plastic substrates) have the characteristics of flexibility and impact resistance. Therefore, in recent years, research on making active components on flexible Flexible displays on substrates. [0003] Generally speaking, the fabrication method of the flexible display is to firstly fix the flexible substrate on the glass carrier. Afterwards, the manufacturing process of display elements is carried out on the fl...

AI Technical Summary

Problems solved by technology

However, the process of some display elements requires higher temperature process conditions to have better electrical properties, but the traditional release layer (mostly organic materials, such as fluorocarbons or hydrocarbons) has poor high temperature tolerance As a result, it is not suitable for high-temperature processes, increasing the time or cost required for manufacturing, etc.

For example, the cost of the release layer made of fluorosilane (fluoroaklylene silane, FAS) is relatively high, and the coverage and reaction time of glass surface modification cannot be determined

The release layer made of parylene still needs high-temperature tempering after deposition to confirm the surface crystallization characteristics, and the process is complicated and takes a long time. In addition, it will be released during the subsequent high-temperature process (such as greater than 400°C). The organic material on the surface of the layer is easy to break the bond and cause the problem of outgassing

In addition, traditional flexible substrates and glass carriers are poor conductors of electricity, so when the flexible substrate is released from the mold, it is easy to cause static electricity to accumulate on the separation surface, causing damage to the display elements on the flexible substrate, which in turn leads to a decrease in process yield

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