Unlock instant, AI-driven research and patent intelligence for your innovation.

Piezoelectric device and method for manufacturing the same

A piezoelectric device and a manufacturing method technology, applied in piezoelectric/electrostrictive/magnetostrictive devices, circuits, electrical components, etc., can solve problems such as reducing manufacturing yield, and achieve the effects of improving reliability and preventing damage

Inactive Publication Date: 2014-10-01
NIHON DEMPA KOGYO CO LTD
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When manufacturing crystal resonators, if such a frequency fluctuation occurs after chip bonding, it will reduce the manufacturing yield and become a problem

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Piezoelectric device and method for manufacturing the same
  • Piezoelectric device and method for manufacturing the same
  • Piezoelectric device and method for manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0088] First Embodiment (Configuration of Piezoelectric Device 100 )

[0089] use Figure 1A , Figure 1B , Figure 2A and Figure 2B , the piezoelectric device 100 of the first embodiment will be described. Such as Figure 1A As shown, the piezoelectric device 100 is a piezoelectric vibrator composed of a cover 110 , a base 120 , and a piezoelectric vibrating piece 130 . Borosilicate glass is used for the cover 110 and the base 120, but it is not limited thereto. For example, in addition to glass such as soda-lime glass, or alkali-free glass, and quartz, aluminum compounds such as silicon or ceramics can be used, or These are the main components, and various materials are added. In addition, the same material is used for the cover 110 and the base 120, but different materials may be used instead. However, when the same material is used, the coefficients of thermal expansion are equal, and stress generation due to temperature changes can be suppressed.

[0090] The cover...

no. 2 approach

[0123] Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the first embodiment are assigned the same reference numerals, and descriptions thereof are omitted or simplified. Figure 5 A piezoelectric device 200 according to the second embodiment is shown. in addition, Figure 5 means along the equivalent Figure 1A Cross-sectional view of the line of the IB-IB line. This piezoelectric device 200 uses the same piezoelectric vibrating piece 130 as that of the first embodiment.

[0124] The piezoelectric device 200 has a cover 210 and a base 220 . The cover 210 is a planar rectangular plate member, such as Figure 5 As shown, in the rear surface (-Y side surface) 210a, the bonding portion to the substrate 220 has sufficient flatness (typically, the average roughness Ra is 1 nm) to be bonded by ion beam activation bonding. about).

[0125] The base 220 is a planar rectangular plate member, such as Figure ...

no. 3 approach

[0129] Third Embodiment (Configuration of Piezoelectric Device 300 )

[0130] use Figure 6A , Figure 6B , Figure 7A and Figure 7B , the piezoelectric device 300 of the third embodiment will be described. Such as Figure 6A As shown, in this piezoelectric device 300 , the cover 310 is joined to the +Y side of the piezoelectric vibrating piece 330 so as to sandwich the piezoelectric vibrating piece 330 , and the base 320 is joined to the −Y side. For the cover 310 and the base 320 , borosilicate glass or the like is used, for example, as in the first and second embodiments.

[0131] Such as Figure 6A and Figure 6B As shown, the cover 310 is formed in a rectangular plate shape, and has a concave portion 311 formed on the back surface (the surface on the −Y side), and a bonding surface 310 a surrounding the concave portion 311 . The bonding surface 310 a is bonded to a front surface (surface on the +Y side) 332 a of a frame portion 332 of a piezoelectric vibrating re...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
mean roughnessaaaaaaaaaa
Login to View More

Abstract

The invention provides a piezoelectric device and the method for manufacturing the same. The piezoelectric device is provided with a piezoelectric vibrating piece which is provided with an electrode and an exposed part; a cover layer which covers the exposed part and is made of a material which has a lower sputtering rate than the material of the electrode.

Description

[0001] This application is based on and claims the benefit of priority of Japanese Patent Application Nos. 2013-065407, 2013-065318, and 2013-065357 filed with the Japan Patent Office on March 27, 2013, the disclosures of which are incorporated herein by reference in their entirety . technical field [0002] The invention relates to a piezoelectric device and a manufacturing method of the piezoelectric device. Background technique [0003] Piezoelectric vibrators (piezoelectric devices) such as crystal resonators are made by mounting a crystal vibrating piece (piezoelectric vibrating piece) in a package (such as ceramics) and then sealing it airtightly or vacuum. However, as the market demand for miniaturization, low profile, and low price of electronic components increases, it becomes difficult to adopt ceramic packages. In order to meet these demands, piezoelectric vibrators using glass packages have been proposed (for example, refer to JP-A-2004-6525 and JP-A-2012-74649)...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/04H03H9/10H01L41/047H01L41/293H10N30/063H10N30/85H10N30/87
CPCH03H9/0509H03H9/1021H03H3/02
Inventor 上条敦川原浩
Owner NIHON DEMPA KOGYO CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com