Method of manufacturing mask read-only memory
A mask read-only, manufacturing method technology, applied in semiconductor/solid-state device manufacturing, electrical solid-state devices, semiconductor devices, etc., can solve problems such as memory unit failure, small photolithography process window, island pattern drift, etc.
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[0033] A mask read-only memory manufacturing method according to the present invention comprises the following steps:
[0034] In the first step, an active region and an isolation region are formed on the silicon substrate 1 .
[0035] Step 2, forming gate oxide layer 2 and gate 3 of each memory cell transistor of the memory in the active region, such as Figure 5 shown.
[0036] Step 3, implanting to form a source region and a drain region.
[0037] Step 4, make the side wall 4 forming the gate, such as Image 6 shown. This step is an optional step, which can be implemented according to the specific requirements of the product, making or omitting the gate spacer.
[0038] Step 5, depositing the first interlayer dielectric 7, such as Figure 7 shown. The material of the deposited first interlayer dielectric 7 is one or any combination of silicon oxynitride, impurity-free silicate glass, and borophosphosilicate glass. The total thickness of the deposited dielectric materi...
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