GaAs photoelectric cathode activation process
A photocathode and process technology, applied in cold cathode manufacturing, electrode system manufacturing, circuits, etc., can solve the problems of sensitivity, stability, noise, life and yield gap of the three generations of microlight tubes, and achieve short activation time, High sensitivity and damage prevention effect
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Embodiment 1
[0016] The GaAs photocathode activation process includes Cs source activation and O source activation. During the activation process, the Cs source activation is performed continuously, and the O source activation is performed intermittently: during the activation process, the Cs source is always on, and in the Continuously measure the photocurrent change during the activation process, turn on the O source activation when the photocurrent reaches the peak value, and stop the O source activation when the photocurrent reaches a new peak value;
[0017] Repeat the above process until the photocurrent no longer rises.
[0018] Compared with the traditional Cs source and O source alternate intermittent activation process, the continuous Cs source and O source intermittent activation method has fewer cycles of Cs source and O source, and is more effective in obtaining a cathode with higher sensitivity and better stability. At the same time, the activation time is short; the Cs sourc...
Embodiment 2
[0020] This embodiment is further limited on the basis of Embodiment 1. In order to further optimize the activation effect or obtain a better quality photocathode, the activation process is performed at a vacuum degree of 10 -7 Pa to 10 -6 It is carried out under the vacuum environment of Pa.
[0021] Before the activation process, a photocathode chemical cleaning step is also included, and the chemical cleaning step includes ultrasonic cleaning and chemical etching performed in sequence;
[0022] The ultrasonic cleaning includes sequential carbon tetrachloride, acetone, absolute ethanol, and deionized water ultrasonic cleaning, and the cleaning time is not less than 3 minutes;
[0023] The chemical etching is chemical etching using a mixture of concentrated sulfuric acid, hydrogen peroxide, and deionized water in a ratio of 2:3:2.
[0024] The chemical etching time is in the range of 5min-7min, and the etching temperature is between 25°C-32°C.
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