Liquid metal dot matrix printing device and printing method

A technology of liquid metal and printing equipment, applied in printing, typewriters, etc., can solve problems such as complex manufacturing procedures of integrated circuits or electronic devices, high environmental pollution, large material and energy consumption, etc., to reduce complexity and cost, and ineffective loss Low, the effect of improving production efficiency

Active Publication Date: 2016-03-02
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a liquid metal dot-type printing device and printing method that can directly print circuits and electronic devices to solve the problem of complex manufacturing procedures and high material and energy consumption of existing integrated circuits or electronic devices. , relatively high environmental pollution and other issues

Method used

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  • Liquid metal dot matrix printing device and printing method
  • Liquid metal dot matrix printing device and printing method
  • Liquid metal dot matrix printing device and printing method

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Embodiment Construction

[0024] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0025] The present invention proposes a liquid metal dot matrix printer for directly printing liquid metal integrated circuits and electronic components. The dot matrix printer includes a control device, a liquid metal printing mechanism and a printer state sensor, wherein:

[0026] The control circuit device is used to control the liquid metal printing mechanism;

[0027] The liquid metal printing mechanical device is used to execute the instructions of the control circuit device to realize different movements of various internal components;

[0028] The printer state sensor is used to monitor some states of the printer.

[0029] The above-mentioned control circuit devi...

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Abstract

The invention relates to the field of printed circuit boards and printed electronic device manufacturing, and particularly relates to a liquid metal needle-type printing device and a printing method. The liquid metal needle-type printing device comprises a control circuit device used for controlling a liquid metal printing machinery device, a liquid metal printing machinery device used for executing instructions of the control circuit device so as to realize different motions of each internal component, and a printing device state sensor used for monitoring the state of the printing device. The liquid metal needle-type printing device and the printing method solve the problems that the manufacturing process of an integrated circuit or an electronic device is complicated, material and energy consumption are large, environmental pollution is relatively high and the like, and excellent technical effects are obtained.

Description

technical field [0001] The invention relates to the field of manufacturing printed circuits and printed electronic devices, in particular to a liquid metal needle printing device and a printing method. Background technique [0002] The integrated circuit is a new type of miniature electronic component or device developed in the 1960s, which has made a big step forward in miniaturization, low power consumption and high reliability of electronic components. It is through the main processing and manufacturing processes such as oxidation, photolithography, diffusion, epitaxy, sputtering, vacuum deposition, etc., and the electronic components such as transistors, diodes, resistors, capacitors, and inductors required to form a circuit with certain functions, and the connections between them The connecting wires are all integrated on a small piece of silicon, and then the electronic devices packaged in a tube are soldered. However, in recent years, the disadvantages of integrated ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41J3/407
Inventor 刘静郑义
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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