Organic light-emitting diode display panel and manufacturing method thereof and display device

A technology for light-emitting diodes and display panels, which is applied in the manufacturing of semiconductor/solid-state devices, semiconductor devices, electrical components, etc., can solve the problems of high production cost of organic light-emitting diodes, bubbles or micro-cracks, and low yield of display devices, etc. Yield, reduce production cost, simplify the effect of manufacturing process

Active Publication Date: 2014-11-26
WUHAN TIANMA MICRO ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of this, an embodiment of the present invention provides an organic light emitting diode display panel, a manufacturing method thereof, and a display device, so as to solve the

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  • Organic light-emitting diode display panel and manufacturing method thereof and display device
  • Organic light-emitting diode display panel and manufacturing method thereof and display device
  • Organic light-emitting diode display panel and manufacturing method thereof and display device

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Embodiment Construction

[0025] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only parts related to the present invention are shown in the accompanying drawings but not the whole content, and the dimensions and sizes of the structures shown in the accompanying drawings are not actual or proportional to the actual the size of the structure.

[0026] exist Figure 2 to Figure 3 A first embodiment of the invention is shown in .

[0027] figure 2 is a schematic plan view of an organic light emitting diode display panel according to the first embodiment of the present invention, image 3 is an organic light emitting diode display panel according to the first embodiment of the present invention a...

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Abstract

The invention discloses an organic light-emitting diode display panel and a manufacturing method thereof and a display device. The organic light-emitting diode display panel includes a first substrate, a second substrate arranged opposite to the first substrate, an organic light-emitting element arranged between the first substrate and the second substrate, a periphery region between the first substrate and the second substrate, and a sealing layer used for packaging the organic light-emitting element between the first substrate and the second substrate in a sealing manner, wherein the sealing layer includes a supporting layer arranged on the first substrate and surrounding the periphery of the organic light-emitting element, and a bonding layer which is arranged between the supporting layer and the second substrate and covers the supporting layer. According to the manufacturing method in the invention, bubbles or a micro-crack phenomenon is not easy to occur in a packaging process of the organic light-emitting diode display panel, thereby simplifying manufacturing technology, reducing production cost, and improving the yield of organic light-emitting diode display panels.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an organic light emitting diode display panel, a manufacturing method thereof, and a display device. Background technique [0002] Organic Light-Emitting Diode (OLED) display has the advantages of good color contrast, high color saturation, active light emission, wide viewing angle, thinning, fast response and low power consumption, etc. popular product. [0003] However, the organic light-emitting layer and electrodes in the organic light-emitting diode device are easily damaged by the intrusion of water vapor and oxygen, resulting in reduced service life. Therefore, the organic light-emitting diode device usually needs to be sealed and packaged. [0004] In the prior art, glass frit (Frit) is generally used as the encapsulation material, and a laser-welded glass technology (Laser-Frit) is used to form an airtight sealing structure, thereby preventing water vapor and oxygen fr...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/52H01L51/56
Inventor 谢再锋
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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