Device for directly manufacturing conductive film at room temperature and method thereof

A conductive thin film, room temperature technology, applied in metal material coating process, melt spraying, coating and other directions, can solve the problems of poor conductivity, high use cost for end users, restricting large-scale popularization and application, and meet the requirements of reducing the environment , Improve production and application efficiency, simplify the effect of the preparation process

Active Publication Date: 2014-12-03
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For ZAO films, room temperature deposition has high light transmittance, but poor conductivity
However, these manufacturing methods based on

Method used

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  • Device for directly manufacturing conductive film at room temperature and method thereof

Examples

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Example Embodiment

[0023] The specific embodiments of the present invention will be described in further detail below in conjunction with the drawings and embodiments. The following examples are used to illustrate the present invention, but not to limit the scope of the present invention.

[0024] Such as figure 1 , The spray film forming device for directly making conductive films at room temperature of the present invention includes: a substrate platform 1, a substrate 2, a field effect control function module 3, a member to be filmed, a spray device 4, a numerical control system 5, and a PC 6 , The member to be filmed 7, the liquid metal ink 8. The base platform supports and fixes the components to be filmed. The field effect control function module provides electromagnetic field and ultrasonic environment for the atomized droplets. The spray device is located above the substrate platform. The numerical control system controls the spray device. Finally, the PC sets the parameters to save the da...

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Abstract

The invention provides a device for directly manufacturing a conductive film at room temperature. The device comprises a spraying device, a numerical control system, a liquid metal ink, a spatial orientation adjustable base platform, a base and a field effect control functional unit, wherein the base platform is used for supporting the base; the base is used for supporting a film-forming member; and the numerical control system is used for controlling the spraying device, the base platform and the field effect control functional unit to aerosolize the liquid metal ink in the spraying device at room temperature and spray the liquid metal ink onto the surface of the film-forming member in a field effect controllable manner. The invention also provides a corresponding method for directly manufacturing the conductive film at room temperature. According to the device and the method for directly manufacturing the conductive film at room temperature, the preparation process can be finished under routine conditions; requirements on the environment are reduced; the preparation technology of conductive and transparent conductive films is simplified remarkably; and production and application efficiency is raised.

Description

technical field [0001] The invention relates to the technical field of conductive thin films, in particular to a device and method for directly manufacturing conductive thin films at room temperature. Background technique [0002] Traditional printed circuit board and integrated circuit technology usually consume energy, water, consumables, complex processes, and cause environmental pollution. For this reason, in recent years, the realization of thin film circuits directly by printing has attracted great attention from all over the world. The key to this type of technology lies in printing patterns and electronic ink technology. So far, in the field of printed electronics, almost all methods still cannot achieve one-step molding, and often require the use of chemical reactions, high-temperature annealing and other steps to realize the manufacture of conductive films. However, we know that more and more electronic devices are developing in the direction of flexibility and u...

Claims

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Application Information

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IPC IPC(8): C23C4/06C23C4/123
Inventor 张琴刘静
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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