Device and method for removing residual liquid from electroplated plate

A technology for removing devices and electroplating plates, applied in the direction of electrolysis process and electrolysis components, can solve problems such as unfavorable and limited production efficiency, and achieve the effects of easy maintenance, reduction of foreign objects and small particles, and easy installation and disassembly.

Active Publication Date: 2014-12-03
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

There are two main ways to reduce the cost of gold: one is to reduce the thickness of the electroplating gold layer, but the customer has clear requirements for the upper and lower limits of the thickness of the electroplating gold layer; For the loss o

Method used

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  • Device and method for removing residual liquid from electroplated plate
  • Device and method for removing residual liquid from electroplated plate
  • Device and method for removing residual liquid from electroplated plate

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Embodiment Construction

[0031] Such as Figure 1 to Figure 3 As shown, a device for removing residual liquid from an electroplating plate includes at least two air pipes 10, a plurality of nozzles 20, and an air filter 30, wherein two air pipes 10 are arranged on both sides above the electroplating tank, and a plurality of nozzles 20 are arranged at intervals The air pipe 10 is connected to the air pipe 10, the air pipe 10 is in communication with the high-pressure air source, and the air filter 30 is arranged between the air pipe 10 and the high-pressure air source.

[0032] The electroplating plate residual liquid removal device described in this embodiment can effectively reduce foreign matter and small particles in the high-pressure air by setting the air filter 30 to filter the high-pressure air, and prevent damage to the surface of the electroplating plate 1. The high-pressure air is sprayed to the On the electroplating plate 1, an impact force is generated on the residual liquid on the electro...

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Abstract

The invention relates to a device and method for removing residual liquid from an electroplated plate. The device for removing residual liquid from the electroplated plate comprises at least two air tubes, a plurality of nozzles and air filters, wherein the two air tubes are arranged on two sides above an electroplating bath; the nozzles are arranged on the air tubes at intervals and are communicated with the air tubes; the air tubes are communicated with a high pressure air source; the air filters are arranged between the air tubes and the high pressure air source. Due to arrangement of the air filter, the high pressure air is filtered, foreign matters and small particles in the high pressure air can be effectively reduced, and the surface of the electroplated plate is prevented from scratch; when the high pressure air is ejected onto the electroplated plate, impact force is generated to the residual liquid on the electroplated plate, then the residual liquid can flow back to the electroplating bath along the surface of the electroplated plate, the consumption of the electroplating liquid caused by residue on the surface of the electroplated plate is reduced, the cost of noble metal is lowered, the removing speed is fast, and the production efficiency is greatly improved; the device is simple in structure, easy to mount and dismount and convenient to repair and maintain.

Description

technical field [0001] The invention relates to the technical field of printed circuits, in particular to a device and method for removing residual liquid from an electroplating plate. Background technique [0002] In the manufacturing process of ordinary printed circuit board factories and packaging substrate factories, the cost of electroplating gold accounts for about 30% of the total cost of raw material consumption. Reducing the cost of gold can effectively reduce the total production cost, improve efficiency and industrialized profits. There are two main ways to reduce the cost of gold: one is to reduce the thickness of the electroplating gold layer, but the customer has clear requirements for the upper and lower limits of the thickness of the electroplating gold layer; For the loss of salt, the general factory adopts to increase the dripping time of the plate on the gold tank after gold plating, but this method is limited to reduce the gold liquid residue on the plate...

Claims

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Application Information

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IPC IPC(8): C25D17/00C25D7/00
Inventor 田生友崔正丹谢添华李志东
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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