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Method for improving particle detection capability

A detection capability, particle technology, applied in the direction of optical testing flaws/defects, etc., can solve the problems of detection limit of minimum defect detection size, poor detection ability of loose particles, lack of uniform directionality, etc., to improve surface flatness and reflective performance, The effect of improving the surface inspection morphology and improving the inspection ability

Inactive Publication Date: 2014-12-03
SHANGHAI HUALI MICROELECTRONICS CORP
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Problems solved by technology

[0003] Although the dark field optical defect detection technology has high performance and high efficiency that other detection technologies such as electron beam microscopes do not have, the dark field optical defect detection technology also has detection limitations on the minimum defect detection size
For example, a type of Surfscan SP2 machine produced by KLA Tencor (Kolei Co., Ltd.) can only detect particles with a size not smaller than 60 nanometers
Moreover, in the dark field optical defect detection technology, the roughness of the semiconductor silicon wafer (chip) surface film and the surface morphology of the particles will also affect the detection capability of the dark field.
For example, the dark-field optical defect detection technology reflects that the ability to detect loose particles with weak scattered light is poor. This is because the loose particles can absorb a certain amount of incident light; , There is no uniform directionality, which also reduces the detection ability of dark field optical defect detection technology

Method used

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  • Method for improving particle detection capability

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Embodiment Construction

[0021] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings. Of course, the present invention is not limited to the following specific embodiments, and general replacements known to those skilled in the art are also covered within the protection scope of the present invention.

[0022] see figure 1 , figure 1 It is a flowchart of a method for improving particle detection capability in the present invention. As shown in the figure, the method for improving particle detection capability of the present invention can be used for dark-field optical defect detection of particles attached to the surface of a silicon wafer after a semiconductor process, including the following steps:

[0023] As shown in block 1, step 1: provide a semiconductor silicon wafer, particles are attached to the surface of the silicon wafer, and the particles include loose particles and / or particles smaller than the minimum...

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Abstract

The invention discloses a method for improving the particle detection capability. A layer of nitride film is deposited on a detected silicon slice, particles which are attached to the surface of the silicon slice and have the sizes are smaller than the minimal defect detection size are amplified to reach the minimal defect detection size, and the dense characteristics of nitride are utilized, so that the loose particles have dense and smooth detected surfaces, the surface detection morphologies of the loose particles are improved, and the reflectivity of the loose particles on incident light and the concentration ratio of the loose particles on scattered light are enhanced, so that the loose particles and defect signals of the particles which have the sizes smaller than the minimal defect detection size can be successfully captured during optical defect detection on a dark field; and therefore, the detection capability on the small particles and the loose particles during the optical defect detection on a dark field is improved.

Description

technical field [0001] The present invention relates to the technical field of optical defect detection in semiconductor manufacturing, and more specifically, to a method for improving the detection capability of small-sized particles and loose particles during dark-field optical defect detection. Background technique [0002] As the semiconductor chip manufacturing technology moves towards a smaller-sized new process technology node, the smaller-sized particles (Particles) produced during the manufacturing process will greatly affect the yield (Yield) and reliability (Reliability) of the chip. Optical defect detection technology is a detection method commonly used in semiconductor integrated circuit chip manufacturing, which is divided into two types: bright field and dark field optical defect detection technology. Among them, dark field optical defect detection technology (Darkfield Inspection) is a detection method that converts the scattered light intensity formed by the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/94
Inventor 钟斌雷通易海兰
Owner SHANGHAI HUALI MICROELECTRONICS CORP