Curable resin composition, method for producing same, highly thermally conductive resin composition, and highly thermally conductive multilayer substrate

Abstract

Provided is a curable resin composition which is capable of forming, at low cost, an insulating adhesive layer that has necessary and sufficient bonding strength and high thermal conductivity. A curable resin composition which contains aluminum nitride particles, an epoxy resin, a curing agent and an acidic phosphoric acid ester represented by general formula (1), and wherein the components are mixed with each other. (In formula (1), R1 represents a hydrocarbyl group having 4-20 carbon atoms; R2 represents a saturated hydrocarbylene group having 1-20 carbon atoms; R3 represents a saturated hydrocarbylene group having 2 or 3 carbon atoms; R4 represents a hydrocarbylene group having 1-8 carbon atoms; k represents a number of 0-20; l represents a number of 0-20; m represents a number of 0-20; and n represents a number of 1-2. In cases where there are a plurality of Ri moieties (wherein i is a number of 1-4), the plurality of Ri moieties may be the same as or different from each other; and the order of k-number -COR2O- groups, l-number -R3O- groups and m-number -COR4COO- groups is arbitrary. In cases where n = 2, the two side chains may be the same as or different from each other.)

Description

Technical field [0001] The present invention relates to a highly thermally conductive resin composition used for heat dissipation of electronic materials. Background technique [0002] Semiconductor components called power semiconductors have been used to transform and modulate the power supply of electronic equipment. The output density of power devices using power semiconductors is rapidly increasing with the requirements for miniaturization and high efficiency of electronic equipment. On the other hand, for the stable operation and life of the element, it is necessary to keep the temperature of the element below a certain temperature, and it is an important issue to efficiently release the heat generated by these elements. Even for such power devices, for heat dissipation of devices with high output power, for example, devices with an output power of 1 kW or more, they are usually used in insulating ceramics with high thermal conductivity such as aluminum nitride, silicon nit...

AI Technical Summary

Problems solved by technology

However, there are the following problems: since silver is used as the brazing material, the raw material cost is high; since the melting point of the brazing material is usually 600° C. or higher, the energy cost for manufacturing is also high; The difference in thermal expansion coefficient between metals may cause peeling between ceramics and metals in severe thermal cycle tests, etc.

However, even if these techniques are applied to epoxy resin, the effect is not sufficient

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