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Exposure method

An exposure method and a technology to be exposed, which are applied in the field of exposure, can solve the problems of low etching rate, decreased etchant concentration, and large etching area, and achieve the effect of increasing pattern density and reducing lithography and etching deviations

Active Publication Date: 2014-12-17
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The area with a higher pattern density needs to be etched larger, and the concentration of the etchant decreases, resulting in a decrease in the etching rate, so that the etching rate of the area with a larger pattern density is lower than that of the area with a smaller pattern density.
As a result, the actual graphics deviate from the design graphics

Method used

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Examples

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no. 1 example

[0034] Please refer to figure 1 , the to-be-exposed pattern has several patterns, and the to-be-exposed pattern has the patterns with two different pitches.

[0035] The to-be-exposed pattern may be any desired pattern in the actual layout design, the to-be-exposed pattern has several graphics, and the graphics need to be formed on the mask later. In the to-be-exposed pattern, there are at least two different spacings between the several patterns, and the size of the patterns meets the requirements of actual circuit design.

[0036] In this embodiment, the to-be-exposed pattern has several rectangular patterns with the same size and parallel to each other. The rectangular pattern is a pattern that appears frequently in chip design. In this embodiment, the patterns to be exposed include: a pattern 11 , a pattern 12 , a pattern 13 , a pattern 14 , a pattern 15 , and a pattern 16 . The to-be-exposed pattern has rectangular patterns with two different pitches, and the two diff...

no. 2 example

[0076] Please refer to Figure 10 , to provide a pattern to be exposed, the pattern to be exposed has several graphics, and the pattern to be exposed has the graphics with two different pitches.

[0077] The several patterns to be exposed include: a pattern 31 , a pattern 32 , a pattern 33 , a pattern 34 , a pattern to be exposed 35 , and a pattern 36 . The pattern has two different pitches d11 and d22.

[0078] In this embodiment, d11 is 32 nm, and the distance d22 between the pattern 33 and the pattern 34 to be exposed is 288 nm.

[0079] The same auxiliary patterns as in the first embodiment are provided, the width of the auxiliary patterns is 32 nm, and the spacing between adjacent auxiliary patterns is 32 nm. In this embodiment, the limit pitch of the single exposure is 64 nm. The critical dimension of the filling area is 224 nm, so the area between the to-be-pattern 33 and the pattern 34 is determined as the filling area, and more than two auxiliary patterns need to b...

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Abstract

The invention relates to an exposure method, which includes: providing a to-be-exposed pattern having several figures with two different spacings; providing a pseudo auxiliary pattern, which includes a certain number of auxiliary figures, with adjacent auxiliary figures having a same spacing; acquiring the width of the auxiliary figures and the spacing of adjacent auxiliary figures; when the spacing of the adjacent figures is greater than or equal to a critical size, determining the area between the adjacent figures as a fill area, with the figures at the edge of fill area being isolate figures; filling the fill area of the to-be-exposed pattern with the auxiliary pattern to form a pseudo to-be-exposed figure; and making a first figure and a second figure form according to the pseudo to-be-exposed figure, and taking the first figure and the second figure as two sets of mask figures of dual graphical exposure respectively. The exposure method provided by the invention can improve the accuracy of etching figures.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, and in particular, to an exposure method. Background technique [0002] As the critical dimensions of semiconductor devices are getting smaller and smaller, the use of a mask as a mask to form a patterning process under the traditional lithography process has encountered limitations, and the adjacent pattern spacing is too small, due to the optical proximity effect, there will be phase differences. The phenomenon of adjacent graphics sticking. [0003] The above-mentioned problems can be solved by a double patterning method. [0004] The double patterning method is to split the mask pattern to be formed into two sets of patterns, namely the first pattern and the second pattern, and then perform the first patterning on the mask layer to form the first pattern and the second pattern respectively. The sub-patterning forms a second pattern, and finally a complete mask pattern is form...

Claims

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Application Information

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IPC IPC(8): H01L21/02G03F7/20
Inventor 倪百兵曹轶宾
Owner SEMICON MFG INT (SHANGHAI) CORP
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