Three-dimensional circuit manufacturing method and thermosetting spraying solution

Abstract

The invention discloses a three-dimensional circuit manufacturing method. The method comprises the steps that a prototype model is generated through a selective laser sintering method; spraying treatment and curing are carried out on the surface of the prototype model through a thermosetting spraying solution containing a soluble metal complex, and a coating film with the surface capable of being activated by laser is formed; the laser is used for carrying out preset selective scanning on the coating film to form a surface activation area; a conductive circuit is formed on the surface activation area through chemical plating. On the basis that the prototype model is obtained through the selective laser sintering method, the surface of the prototype model is coated with the coating film through the thermosetting solution, the limitation brought by traditional SLS processing materials on the application is overcome, a matrix with the complex surface is formed with no appearance limitation, and the requirements for rapid manufacturing and forming of the conductive circuit and laser activation are effectively met.

Description

technical field [0001] The invention relates to a manufacturing method of a three-dimensional circuit and a thermosetting spraying solution. Background technique [0002] For the manufacturing process of electronic appliances and electromechanical products and the corresponding material technology, the pursuit direction is flexibility, environmental protection, speed and energy saving. The industry has developed a technology called 3D-MID (Three-dimensional molded interconnect device or electronic assemblies), which forms precise and compact conductive patterns on the surface of plastic, and electronic components can be directly welded on the plastic shell or inner shell to form Electronic appliances and mechatronics products without printed circuit boards. This technology is applied to the production of three-dimensional circuits, which saves circuit space for electronic and electrical products and electromechanical products, and realizes flexible manufacturing of circuits...

AI Technical Summary

Problems solved by technology

[0007] However, traditional SLS parts cannot meet the requirements of laser surface activation, and there is no laser equipment that can effectively integrate SLS technology, so it is impossible to manufacture products with circuits inside plastic parts through traditional SLS technology

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