Three-dimensional circuit manufacturing method and thermosetting spraying solution

A manufacturing method and three-dimensional circuit technology, applied in the directions of printed circuit manufacturing, printed circuits, coatings, etc., can solve the problems of not meeting the requirements of laser surface activation, unable to manufacture plastic parts, integrating SLS process, etc., to meet the requirements of laser activation and Forming requirements for conductive lines, lowering the cost of industrial popularization, and the effect of not being restricted by shape

Active Publication Date: 2014-12-24
SHENZHEN SUNSHINE LASER & ELECTRONICS TECH CO LTD
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  • Abstract
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  • Application Information

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Problems solved by technology

[0007] However, traditional SLS parts cannot meet the requirements of laser surface activation, and there is no laser equipment that can effe...

Method used

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  • Three-dimensional circuit manufacturing method and thermosetting spraying solution

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Embodiment Construction

[0029] Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be emphasized that the following description is only exemplary and not intended to limit the scope of the invention and its application.

[0030] In some embodiments, a method for manufacturing a three-dimensional circuit is as figure 1 shown, including the following steps.

[0031] step one , Prototypes are generated by selective laser sintering (SLS).

[0032] The process parameters of laser selective sintering to prepare the prototype are as follows:

[0033] Laser selective sintering equipment is used to manufacture prototypes. A carbon dioxide infrared laser with a wavelength of 10.6 μm and a power of 10W~40W can be used as a sintering source. The laser scanning rate is 3~5m / s, the spot diameter is 0.5mm, and X, Y, and Z axes are processed. Shrinkage compensation rate X is 2.85~3.82%, Y is 2.85~3.82%, Z(0) is 2.10~3.22%, Z(300) is 1.4...

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Abstract

The invention discloses a three-dimensional circuit manufacturing method. The method comprises the steps that a prototype model is generated through a selective laser sintering method; spraying treatment and curing are carried out on the surface of the prototype model through a thermosetting spraying solution containing a soluble metal complex, and a coating film with the surface capable of being activated by laser is formed; the laser is used for carrying out preset selective scanning on the coating film to form a surface activation area; a conductive circuit is formed on the surface activation area through chemical plating. On the basis that the prototype model is obtained through the selective laser sintering method, the surface of the prototype model is coated with the coating film through the thermosetting solution, the limitation brought by traditional SLS processing materials on the application is overcome, a matrix with the complex surface is formed with no appearance limitation, and the requirements for rapid manufacturing and forming of the conductive circuit and laser activation are effectively met.

Description

technical field [0001] The invention relates to a manufacturing method of a three-dimensional circuit and a thermosetting spraying solution. Background technique [0002] For the manufacturing process of electronic appliances and electromechanical products and the corresponding material technology, the pursuit direction is flexibility, environmental protection, speed and energy saving. The industry has developed a technology called 3D-MID (Three-dimensional molded interconnect device or electronic assemblies), which forms precise and compact conductive patterns on the surface of plastic, and electronic components can be directly welded on the plastic shell or inner shell to form Electronic appliances and mechatronics products without printed circuit boards. This technology is applied to the production of three-dimensional circuits, which saves circuit space for electronic and electrical products and electromechanical products, and realizes flexible manufacturing of circuits...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/10C09D201/00C09D161/20C09D7/12
Inventor 蔡志祥王浩杨伟邹凯南威
Owner SHENZHEN SUNSHINE LASER & ELECTRONICS TECH CO LTD
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