Method for manufacturing multiple solder mask layers on PCB

Abstract

The invention relates to the technical field of production of PCBs, in particular to a method for manufacturing multiple solder mask layers on a PCB. The method includes the steps that first, identifications used for marking the solder mask layers are manufactured on a technological side, then, the solder mask layers are manufactured, the corresponding identifications are exposed at the same time, and the identifications are covered with the solder mask layers. According to the method, the identifications used for marking the solder mask layers are manufactured on the technological side of the PCB, the corresponding identifications are covered with the solder mask layer when each solder mask layer is manufactured, the corresponding identifications of the other solder mask layers which have not been manufactured are exposed, and therefore the manufacturing condition of the solder mask layers can be inspected through direct observation, inspection operation is easy and convenient to perform, and mistakes and omissions can be avoided; it is not needed that the PCB is moved to an magnifying lens device, and it can be avoided that the solder mask layers are scratched or contaminated in the moving process of the PCB. The method is simple and easy to implement and convenient to operate, and the production efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of PCB production, in particular to a method for manufacturing a multi-layer solder resist layer on a PCB. Background technique [0002] The printed circuit board is the support of electronic components and provides electrical connections for electronic components. The production process of printed circuit boards is generally: material cutting → inner layer pattern transfer → inner layer etching → lamination → drilling → sinking copper → full board electroplating → outer layer pattern transfer → pattern electroplating → etching → solder mask → surface Processing → forming processing. Among them, the solder resist layer is made on the PCB with the outer layer circuit, which can prevent short circuit and corrosion caused by moisture, chemicals, etc. between the conductor lines; it can also prevent open circuits caused by poor operation during the production and assembly of components; and It can insulate the...

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problems that the existing multi-layer solder resist layer manufacturing method is prone to missing individual solder resist layers, which is inconvenient for inspection, and the inspection is prone to errors and omissions, and the inspection efficiency is low. It provides a method that can avoid missing individual solder resist layers. , and can be inspected directly and the manufacturing method of the multi-layer solder resist layer with high inspection efficiency

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