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Bonding method, bond structure, and manufacturing method for same

A technology for joining structures and joining methods, which can be applied to manufacturing tools, connections, welding equipment, etc., can solve problems such as equipment and process constraints, and achieve the effects of excellent reliability, void-free heat resistance, and excellent heat resistance.

Inactive Publication Date: 2014-12-24
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] Also, in the bonding method of Patent Document 2, it is necessary to prepare solder paste separately from the object to be bonded, and there are restrictions on equipment and processes for implementing the bonding method.

Method used

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  • Bonding method, bond structure, and manufacturing method for same
  • Bonding method, bond structure, and manufacturing method for same
  • Bonding method, bond structure, and manufacturing method for same

Examples

Experimental program
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Effect test

Embodiment approach 1

[0060] In this embodiment, a chip-type electronic component (multilayer ceramic capacitor) having external electrodes disposed on both ends of a ceramic laminate is mounted on electrodes for mounting on a glass epoxy substrate. The case where an external electrode (first object to be bonded) is bonded to a mounting electrode (second object to be bonded) on a glass epoxy substrate will be described as an example.

[0061] [Preparation of chip-type electronic components and glass epoxy substrates]

[0062] First, if figure 1 As shown in FIG. The plating layer 2 formed by plating Sn or an alloy containing Sn (first metal) shown in the sample numbers 1 to 25 in Tables 1 and 2 is plated on the surface of the external electrode main body 1 composed of a Cu thick film electrode.

[0063] In addition, although not shown in the figure, a Ni plating layer is formed between the Cu thick-film electrode and the plating layer 2 of Sn or an alloy containing Sn.

[0064] In addition, the ...

Embodiment approach 2

[0109] In Embodiment 1 above, a chip-type electronic component including an external electrode (first object to be joined) having a first metal (Sn or alloy containing Sn) plating layer and a chip-type electronic component having a second metal (Cu alloy) plating layer are used. The case where the glass epoxy substrate of the mounting electrode (second bonding object) and the external electrode of the chip-type electronic component and the mounting electrode of the glass epoxy substrate are bonded has been described as an example, but in the second embodiment, Use a glass epoxy substrate with a mounting electrode (first object to be joined) plated with a first metal (Sn or an alloy containing Sn) and an external electrode (second object to be joined) with a second metal (Cu alloy) plated layer object) chip-type electronic component, the mounting electrode (first bonding object) of the glass epoxy substrate and the external electrode (second bonding object) of the chip-type elec...

Embodiment approach 3

[0120] In Embodiment 3, a case will be described in which a bump provided on an electrode on the bottom surface of an IC chip as a first object to be bonded is bonded to a mounting electrode on a substrate as a second object to be bonded.

[0121] First, prepare as Figure 6 IC chip 31 is shown. This IC chip 31 has a bump (first object to be bonded) 23 provided on the electrode 32 on the bottom surface thereof, and the bump 23 is formed with Sn or a Sn-containing alloy (first metal alloy) on the surface of the bump core 21. ) constitutes the coating 22.

[0122] As the first metal, for example, materials shown in sample numbers 1 to 25 in Table 1 and Table 2 can be used.

[0123] As the bump core 21, a material capable of forming the plated layer 22 with the first metal on its surface, such as Au, is used.

[0124] In addition, the plated layer 22 does not need to cover the entire surface of the bump core 21, as long as it reacts with the second metal (Cu alloy in this embo...

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Abstract

Provided are a bonding method which can obtain a bond section which has no air gaps, is precise, has high heat-resistance and excellent reliability, and a bond structure having a highly reliable bond section. When bonding a first object to be bonded and a second object to be bonded, the first object to be bonded includes a first metal formed from Sn or an alloy containing Sn, the second object to be bonded includes a second metal formed from an alloy containing Cu and at least one metal selected from Ni, Mn, Al and Cr, and heat treatment is carried out when the first object to be bonded and the second object to be bonded are in contact with one another, and the first object to be bonded and the second object to be bonded are bonded by generating intermetallic compounds on the interface between the objects. Preferably, an alloy containing at least 70 wt% Sn is used for the first metal. More preferably, an alloy containing at least 85 wt% Sn is used for the first metal.

Description

technical field [0001] The present invention relates to a joining method for joining one object to be joined (first object to be joined) to the other object to be joined (second object to be joined), a joined structure formed using the joining method, and a method for manufacturing the same. Background technique [0002] As a mounting method for mounting surface-mount electronic components on a substrate or the like, a method of soldering and mounting external electrodes of the electronic component to mounting electrodes (land electrodes) or the like on the substrate is widely used. [0003] As a solder paste used in such a method of mounting by soldering, it has been proposed, for example, to contain (a) a second metal ( or alloy) balls and (b) a mixture of first metal balls made of Sn or In (see Patent Document 1). [0004] In addition, Patent Document 1 also discloses a bonding method using this solder paste and a method of manufacturing an electronic device. [0005] H...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/19B23K1/00B23K35/30C22C9/05C22C9/06B23K35/26B23K101/42C22C9/00C22C9/01C22C13/00C22C13/02
CPCB23K1/00B23K1/19B23K35/262B23K35/302C22C9/05C22C9/06C22C13/00C22C13/02C22C9/01C22C9/00B23K2101/42B23K1/0016C21D9/50B23K20/00
Inventor 中野公介关本裕之高冈英清钓贺大介
Owner MURATA MFG CO LTD