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Photosensitive resin used in 3D printing, and its preparation method

A photosensitive resin, 3D printing technology, applied in the field of 3D printing, can solve the problems of low curing efficiency, poor performance of parts, high irritation, etc., to achieve the effect of fast molding, cost reduction, and improvement of molding speed

Inactive Publication Date: 2014-12-31
HEFEI GENIUS NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing photosensitive resins have the disadvantages of low curing efficiency, poor product performance, high irritation and high cost due to matrix matching and formula design.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] (1) Prepare raw materials in the following proportions:

[0036] 20 parts of epoxy acrylate monoester,

[0037] 15 parts of urethane acrylate,

[0038] 35 parts of phenolic epoxy resin,

[0039] 10 parts of glycidyl methacrylate,

[0040] 10 parts of trimethylolpropane triacrylate,

[0041] 0.1 part of dimethyl polysiloxane as defoamer,

[0042] 0.1 part of silicone-ethylene oxide copolymer of leveling agent,

[0043] Cationic initiator iodonium salt" 1 part,

[0044] Free radical type photopolymerization initiator benzophenone 1 part,

[0045] One part of chlorinated benzophenone, a radical photopolymerization initiator.

[0046] (2) Add the above-mentioned raw materials to a special glass three-necked flask equipped with a stirrer and a condenser to mix;

[0047] (3) The mixture is heated to 50°C, and stirred with a stirrer for about 30 minutes to obtain a light yellow uniform liquid, which is a photosensitive resin for 3D printing.

[0048]

Embodiment 2

[0050] (1) Prepare raw materials in the following proportions:

[0051] 40 parts of epoxy acrylate monoester,

[0052] 15 parts of phenolic epoxy resin,

[0053] 20 parts of bisphenol A epoxy resin,

[0054] 10 parts of glycidyl methacrylate,

[0055] 15 parts of ethoxylated trimethylolpropane triacrylate,

[0056] Antifoaming agent dimethyl polysiloxane 1 part,

[0057] Antifoaming agent polyether siloxane 1 part,

[0058] Leveling agent silicone-ethylene oxide copolymer 1 part,

[0059] Leveling agent silicone-propylene oxide copolymer 1 part,

[0060] 1 part of cationic initiator iodonium salt,

[0061] 3 parts of benzophenone, a radical photopolymerization initiator.

[0062] (2) Add the above-mentioned raw materials to a special glass three-necked flask equipped with a stirrer and a condenser to mix;

[0063] (3) The mixture is heated to 60°C, and stirred with a stirrer for about 25 minutes to obtain a light yellow uniform liquid, which is a photosensitive resin for 3D printing.

[0064]

Embodiment 3

[0066] (1) Prepare raw materials in the following proportions:

[0067] 35 parts of epoxy acrylate monoester,

[0068] 40 parts of phenolic epoxy resin,

[0069] 20 parts of trimethylolpropane triacrylate,

[0070] Antifoaming agent dimethyl polysiloxane 2 parts,

[0071] Leveling agent silicone-ethylene oxide copolymer 2 parts,

[0072] Cationic initiator iodonium salt 5 parts,

[0073] 8 parts of benzophenone, a radical photopolymerization initiator.

[0074] (2) Add the above-mentioned raw materials to a special glass three-necked flask equipped with a stirrer and a condenser to mix;

[0075] (3) The mixture is heated to 70°C, and stirred with a stirrer for about 20 minutes to obtain a light yellow uniform liquid, which is a photosensitive resin for 3D printing.

[0076]

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PUM

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Abstract

The invention provides a photosensitive resin used in 3D printing, and its preparation method. The photosensitive resin is prepared by using 35-40 parts of acrylate, 35-40 parts of epoxy resin, 20-30 parts of a diluent, 0.1-5 parts of an antifoaming agent, 0.1-5 parts of a leveling agent, 1-10 parts of a cationic initiator and 1-10 parts of a free radical photopolymerization initiator. The photosensitive resin prepared in the invention has the characteristics of fast forming speed, small irritation, simple process, low cost and the like, and can be directly applied in 3D printing to make products with complex structures.

Description

[0001] technical field [0002] The invention relates to the technical field of 3D printing, in particular to a photosensitive resin for 3D printing and a preparation method thereof. Background technique [0003] 3D printer, also known as three-dimensional stereo printer, is a new type of manufacturing technology based on material accumulation method. Its basic principle is "manufacturing in layers, adding layer by layer". Metal powder, ceramic powder, plastic, cell tissue and other special materials are stacked and bonded layer by layer by means of laser beams, hot melt nozzles, etc., and finally superimposed and formed to manufacture physical products. When working, the powder spreading roller moves left and right, and the powder in the powder supply tank is evenly laid on the forming cylinder, and then the cross-sectional shape is sprayed on the first layer of powder by the printing head according to the designed part model, and then the forming cylinder moves to the Mov...

Claims

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Application Information

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IPC IPC(8): C08L51/08C08L63/00C08L63/04C08F283/10C08F283/00C08F283/01B29C67/00
Inventor 杨桂生李枭孙利明姚晨光
Owner HEFEI GENIUS NEW MATERIALS
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