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A LED package structure and a manufacture method thereof

An LED packaging and manufacturing method technology, applied in electrical components, electric solid devices, circuits, etc., can solve the problems of inability to ensure the uniformity of phosphor coating, inability to control the concentration of white light color areas, and brightness attenuation of white light diodes. The light color distribution of the package is easy to control, improve the uniformity of light emission, and reduce the effect of light decay

Inactive Publication Date: 2014-12-31
NANTONG TONGFANG SEMICON +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this packaging method has considerable limitations. First, the heat generated by the LED device produced by this method will age the phosphor powder during long-term operation, which will cause the brightness of the white light diode to decay quickly, seriously affecting the service life.
Secondly, this method cannot guarantee the uniformity of the entire phosphor coating, so it cannot control the concentration of the white light color area, which affects the production yield
In addition, the beam angle of the LED light source packaged by this method is only about 110-120 degrees, which can be applied to lighting occasions, but the beam angle is not large enough, and the light energy utilization efficiency is not high

Method used

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  • A LED package structure and a manufacture method thereof
  • A LED package structure and a manufacture method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] 1) Provide the LED package base 100;

[0025] 2) Coating an adhesive layer 110 on the package base 100, and the adhesive layer 110 is made of transparent insulating adhesive, silver adhesive or solder paste;

[0026] 3) Fix the light-emitting diode chip 120 on the package base 100 through the adhesive layer 110, and bake and cure at a high temperature, the high-temperature curing temperature is 80°C, and the baking time is 0.5 hours;

[0027] 4) Through the dispensing process, the first encapsulation colloid layer 150 is formed on the surface of the light-emitting diode chip 120, and is cured and formed by high-temperature baking, the high-temperature curing temperature is 80°C, and the baking time is 0.5 hours;

[0028] 5) Through the dispensing process, the second encapsulation colloid layer 151 is formed on the surface of the first encapsulation colloid layer 150, and is formed by baking at a high temperature. The high-temperature curing temperature is 80°C, and the ...

Embodiment 2

[0030] 1) Provide the LED package base 100;

[0031] 2) Coating an adhesive layer 110 on the package base 100, and the adhesive layer 110 is made of transparent insulating adhesive, silver adhesive or solder paste;

[0032] 3) Fix the light-emitting diode chip 120 on the package base 100 through the adhesive layer 110, and bake and cure at high temperature, the high-temperature curing temperature is 150°C, and the baking time is 1.5 hours;

[0033] 4) Through the dispensing process, the first encapsulation colloid layer 150 is formed on the surface of the light-emitting diode chip 120, and is cured and formed by high-temperature baking, the high-temperature curing temperature is 150°C, and the baking time is 1.5 hours;

[0034] 5) Through the dispensing process, the second encapsulation colloid layer 151 is formed on the surface of the first encapsulation colloid layer 150, and is formed by baking at a high temperature. The high-temperature curing temperature is 150°C, and th...

Embodiment 3

[0036] 1) Provide the LED package base 100;

[0037] 2) Coating an adhesive layer 110 on the package base 100, and the adhesive layer 110 is made of transparent insulating adhesive, silver adhesive or solder paste;

[0038] 3) Fix the light-emitting diode chip 120 on the package base 100 through the adhesive layer 110, and bake and cure at a high temperature, the high-temperature curing temperature is 200°C, and the baking time is 3 hours;

[0039] 4) Through the dispensing process, the first encapsulation colloid layer 150 is formed on the surface of the light-emitting diode chip 120, and is cured and formed by high-temperature baking, the high-temperature curing temperature is 200°C, and the baking time is 3 hours;

[0040] 5) Then through the dispensing process, a second encapsulation colloid layer 151 is formed on the surface of the first encapsulation colloid layer 150, and is formed by baking at a high temperature. The high-temperature curing temperature is 200°C, and t...

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PUM

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Abstract

The invention describes a LED package structure and a manufacture method thereof, relating to a field of a light emitting diode. The inventive structure comprises a package base, an adhesion layer, a light emitting diode chip and two wire solders. The light emitting diode chip is affixed within the package base by the adhesion layer, whilst positive and negative electrodes of the light emitting diode chip are electrically linked to the package base by the two wire solders. The inventive structure is characterized in that an inside of the package base and a periphery of the light emitting diode chip are filled with a first package colloid layer employing a light-transmitting material, the top of the first package colloid layer is covered by a second package colloid layer which contains a fluorescent powder material therein. As compared with the existing art, the LED package structure and the manufacture method thereof in the invention are capable of reducing effectively light attenuation, enhancing light emission efficiency, increasing a beam angle range and improving light emission uniformity and utilization of the light emitting diode.

Description

technical field [0001] The invention relates to the technical field of light emitting diodes, in particular to an LED packaging structure and a manufacturing method thereof. Background technique [0002] Light-emitting diodes (Lighting Emitting Diode) have been widely used in signal display, display backlight, traffic signal indication, outdoor advertising display and landscape lighting. In recent years, due to the successful development of blue light-emitting diodes based on nitrides, light-emitting diodes can achieve full-color light emission and gradually move towards the era of white light illumination. White light emitting diodes have many advantages such as high efficiency, long life, high reliability, environmental protection and energy saving, and flexible application. They are generally recognized as the fourth-generation lighting source and have broad development prospects. At present, white LEDs are relatively mature, and the commercialized way to obtain them is ...

Claims

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Application Information

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IPC IPC(8): H01L33/52H01L33/54H01L33/56H01L33/58H01L33/00
CPCH01L2224/48091H01L2224/73265H01L2924/181H01L2924/00014H01L2924/00012H01L33/54H01L33/005H01L33/0095H01L33/505H01L33/507H01L33/52H01L33/56H01L33/60H01L2933/0041H01L2933/005H01L2933/0058
Inventor 吴东海李鹏飞董发
Owner NANTONG TONGFANG SEMICON