LED (light emitting diode) wafer encapsulation method

A chip packaging and chip technology, used in electrical components, circuits, semiconductor devices, etc., can solve the problems of low electrical conductivity and thermal conductivity, lack of ductility, and high cost, reducing thermal resistance, improving luminous efficiency, and reducing work. effect of temperature

Inactive Publication Date: 2014-12-31
江西量一光电科技有限公司
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Problems solved by technology

And the gold wire has the characteristics of thermal expansion and contraction, easy to break, no ductility, electrical conductivit

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  • LED (light emitting diode) wafer encapsulation method

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[0021] The specific implementation of the present invention will be further described.

[0022] An LED chip packaging method, which includes the following steps:

[0023] (1) Crystal expansion: the expansion machine is used to expand the entire LED chip film uniformly, so that the tightly arranged LED crystal grains attached to the film surface are pulled apart to facilitate the thorn crystal;

[0024] (2) Dot the bottom glue: dot silver glue or insulating glue on the corresponding position of the bracket;

[0025] For GaAs, SiC conductive substrates, red, yellow, and yellow-green chips with back electrodes, silver glue is used; for blue and green LED chips with sapphire insulating substrate, insulating glue is used to fix the chip. Or use a glue preparation machine to first coat the silver glue on the back electrode of the LED product, and then install the LED product with silver glue on the back on the LED product bracket. The glue preparation efficiency is much higher than that of ...

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Abstract

The invention provides an LED (light emitting diode) wafer encapsulation method, which comprises the following steps of (1) wafer expansion; (2) primer glue or standby glue application; (3) wafer fixation; (4) drying; (5) welding; and (6) encapsulation. In the welding process, a traditional gold wire is replaced by a transparent grapheme sheet. The LED wafer encapsulation method has the advantages that the LED heat radiation capability is improved, the heat resistance is reduced, and the work temperature of an LED wafer is reduced, so the LED luminous efficiency is improved.

Description

technical field [0001] The invention relates to an LED chip packaging method, in particular to a transparent graphene sheet replacing gold wire welding LED chip packaging method. Background technique [0002] LED has the advantages of small size, long life, and low power consumption, so it is widely used in 3C product indicators and display devices. In view of this, in order to improve the competitiveness in the market, LED-related industries are all seeking to improve the luminous efficiency, so as to improve their own advantages. Reducing the thermal resistance of LED and improving the heat dissipation capacity of LED are the key technologies to improve the luminous efficiency. In order to solve this problem, the current LED chip packaging method is to improve the heat dissipation capability of the substrate. It is unprecedented in the prior art to use transparent graphene sheets instead of gold wires to improve the thermal conductivity and electrical conductivity of LED...

Claims

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Application Information

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IPC IPC(8): H01L33/62H01L33/64
CPCH01L33/0095H01L33/62H01L33/641H01L33/647H01L2933/0075
Inventor 廖昆
Owner 江西量一光电科技有限公司
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