Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

LED (light emitting diode) wafer encapsulation method

A chip packaging and chip technology, used in electrical components, circuits, semiconductor devices, etc., can solve the problems of low electrical conductivity and thermal conductivity, lack of ductility, and high cost, reducing thermal resistance, improving luminous efficiency, and reducing work. effect of temperature

Inactive Publication Date: 2014-12-31
江西量一光电科技有限公司
View PDF3 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And the gold wire has the characteristics of thermal expansion and contraction, easy to break, no ductility, electrical conductivity and thermal conductivity are much lower than transparent graphene sheets, but the cost is higher than transparent graphene sheets

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED (light emitting diode) wafer encapsulation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The specific implementation manner of the present invention will be further described.

[0022] A LED chip packaging method, the method comprises the following steps:

[0023] (1) Crystal expansion: Use an expansion machine to evenly expand the entire LED wafer film, so that the LED grains that are closely arranged on the surface of the film are pulled apart to facilitate spinning;

[0024] (2) Dot primer: Dot silver glue or insulating glue on the corresponding position of the bracket;

[0025] For GaAs and SiC conductive substrates, silver glue is used for red, yellow, and yellow-green chips with back electrodes; for blue and green LED chips with sapphire insulating substrates, insulating glue is used to fix the chips. Or use a glue preparation machine to apply silver glue on the back electrode of the LED product first, and then install the LED product with silver glue on the back of the LED product bracket. The efficiency of glue preparation is much higher than dispe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an LED (light emitting diode) wafer encapsulation method, which comprises the following steps of (1) wafer expansion; (2) primer glue or standby glue application; (3) wafer fixation; (4) drying; (5) welding; and (6) encapsulation. In the welding process, a traditional gold wire is replaced by a transparent grapheme sheet. The LED wafer encapsulation method has the advantages that the LED heat radiation capability is improved, the heat resistance is reduced, and the work temperature of an LED wafer is reduced, so the LED luminous efficiency is improved.

Description

technical field [0001] The invention relates to an LED chip packaging method, in particular to a transparent graphene sheet replacing gold wire welding LED chip packaging method. Background technique [0002] LED has the advantages of small size, long life, and low power consumption, so it is widely used in 3C product indicators and display devices. In view of this, in order to improve the competitiveness in the market, LED-related industries are all seeking to improve the luminous efficiency, so as to improve their own advantages. Reducing the thermal resistance of LED and improving the heat dissipation capacity of LED are the key technologies to improve the luminous efficiency. In order to solve this problem, the current LED chip packaging method is to improve the heat dissipation capability of the substrate. It is unprecedented in the prior art to use transparent graphene sheets instead of gold wires to improve the thermal conductivity and electrical conductivity of LED...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/62H01L33/64
CPCH01L33/0095H01L33/62H01L33/641H01L33/647H01L2933/0075
Inventor 廖昆
Owner 江西量一光电科技有限公司
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com