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Embedding method of heat pipe with low thermal contact resistance

A technology of contact thermal resistance and heat pipe, which is applied to the devices for controlling the living conditions of space vehicles, etc., can solve the problems of uncollected data, no explanation or report found, etc. Effect

Active Publication Date: 2016-08-24
SHANGHAI SATELLITE ENG INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] At present, there is no description or report of the similar technology of the present invention, and no similar data at home and abroad have been collected yet.

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  • Embedding method of heat pipe with low thermal contact resistance

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Embodiment Construction

[0024] The following is a detailed description of the embodiments of the present invention: this embodiment is implemented on the premise of the technical solution of the present invention, and provides detailed implementation methods and specific operation processes. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

[0025] Such as figure 1 As shown, this embodiment provides a heat pipe embedding method with low contact thermal resistance, including the following steps:

[0026] Step 1, pre-baking the raw materials of the film to obtain the film to be used;

[0027] Step 2, according to the actual size of the heat pipe, apply the adhesive film to be used obtained in step 1 on the heat pipe area, and control the number of bubbles in the adhesive film coated on the heat pipe area.

[0028] Further, ...

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Abstract

The invention provides a heat pipe pre-embedding method with low contact thermal resistance, comprising the following steps: step 1, pre-baking the raw material of the film at 90°C and 30% humidity for 60 minutes to obtain the film to be used; step 2, according to For the actual size of the heat pipe, apply the adhesive film to be used obtained in step 1 on the heat pipe area, and control the number of bubbles in the adhesive film coated on the heat pipe area. The invention has the following beneficial effects: (1) It can reduce the contact thermal resistance between the embedded heat pipe and the honeycomb core, improve the heat transfer performance of the heat pipe, and is beneficial to the heat dissipation of a single machine and the realization of isothermal design; (2) The process method is simple, the material source is sufficient, and it is easy to Realization, the implementation cost is low.

Description

technical field [0001] The invention relates to a heat pipe process used in the field of space technology, in particular to a heat pipe pre-embedding method with low contact thermal resistance. Background technique [0002] A heat pipe is a device that uses the evaporation, condensation, phase change and circulation of the working fluid to work. Due to the small thermal resistance when the liquid evaporates and condenses, a large amount of heat can be transferred under a small temperature difference by using a heat pipe. Since the concept of heat pipe was first proposed in 1964, heat pipe technology has been fully developed and successfully applied in the field of space technology. Due to the outstanding characteristics of large heat transfer, compact structure, no moving parts and no energy consumption, heat pipes have become one of the main means of spacecraft thermal control in the past ten years. At present, the most widely used heat pipes on satellites are aluminum am...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B64G1/50
Inventor 李鹏郭涛康奥峰赵鑫李应典
Owner SHANGHAI SATELLITE ENG INST