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MEMS cantilever type accelerometer and manufacture process thereof

An accelerometer and cantilever beam technology, applied in the field of sensors, can solve the problems of reducing the reliability of accelerometer detection, unsymmetrical vibration mode shape, collision between mass block and frame, etc., to ensure detection stability and reduce crosstalk and impact, the effect of high accuracy

Active Publication Date: 2015-01-21
INST OF GEOLOGY & GEOPHYSICS CHINESE ACAD OF SCI
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AI Technical Summary

Problems solved by technology

makes the swing mode shape of this accelerometer less symmetrical
In addition, when the external impact force is large, the cantilever beam will break and the mass block will collide with the frame.
Not only greatly reduces the detection reliability of the accelerometer, but even makes the accelerometer unable to work

Method used

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  • MEMS cantilever type accelerometer and manufacture process thereof
  • MEMS cantilever type accelerometer and manufacture process thereof
  • MEMS cantilever type accelerometer and manufacture process thereof

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Embodiment Construction

[0055] Below in conjunction with accompanying drawing, the present invention is described in further detail:

[0056] refer to figure 1 According to a MEMS cantilever accelerometer provided by the present invention, it comprises: a measuring body 1, an upper cover plate 2 connected to the measuring body 1 and a lower cover plate 3; the measuring body 1 adopts an upper silicon The epitaxial silicon-on-insulator structure of the layer 4 and the lower silicon layer 5 is referred to as the SOI structure. A buried oxide layer 6 is respectively arranged between each silicon layer.

[0057] see figure 2 , the measuring body 1 includes a frame 11 and a mass block 12 located in the frame 11 ; the mass block 12 and the frame 11 are connected by a cantilever beam 13 . A plurality of cantilever beams 13 are arranged in the space between the proof mass 12 and the frame 11 . Preferably, the mass block 12 is a square, and the cantilever beams are symmetrically arranged on both sides of ...

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Abstract

The invention provides an MEMS cantilever type accelerometer and a manufacture process thereof. The MEMS cantilever type accelerometer comprises a measuring body, an upper cover plate and a lower cover plate, wherein the upper and lower cover plates are connected with the measuring body; the measuring body comprises a frame and a counterweight block placed in the frame, and the counterweight block is connected with the frame via multiple cantilevers; and buffer beams are arranged between the counterweight block and the frame, one end of each buffer beam is connected with the counterweight block, and the other end of the buffer beam is connected with the frame. The buffer beams can effectively protect the accelerometer and prevent the accelerometer from damage caused by too large external force.

Description

technical field [0001] The invention relates to the field of sensors, in particular to an accelerometer and a manufacturing process thereof. Background technique [0002] Today, accelerometers are used in many applications, such as measuring the intensity of earthquakes and collecting data, detecting the impact strength of automobile collisions, and detecting the angle and direction of tilt in mobile phones and game consoles. With the continuous advancement of microelectromechanical systems (MEMS) technology, many small accelerometers at the nanometer scale have been widely used commercially. [0003] A traditional capacitive accelerometer, such as a Chinese patent with the patent number ZL03112312.0 and an announcement date of May 30, 2007, includes a cantilever beam and a mass. When there is acceleration, the mass block of the accelerometer will move towards the acceleration direction, so that the gap distance between the mass block and the electrode will change and lead ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01P15/125B81C1/00
Inventor 于连忠孙晨
Owner INST OF GEOLOGY & GEOPHYSICS CHINESE ACAD OF SCI
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