Anisotropic conductive film containing benzoxazine and preparation method of anisotropic conductive film

Abstract

The invention relates to an anisotropic conductive film containing benzoxazine. The anisotropic conductive film comprises a flexible base material and an anisotropic conductive adhesive layer, wherein the anisotropic conductive adhesive layer is prepared by coating anisotropic conductive adhesive on the flexible base material through drying; the anisotropic conductive adhesive consists of the following components in percentage by mass: 25-50% of benzoxazine and derivative monomers thereof, 25-45% of film-forming resin, 4-20% of conductive particles, 1-4% of silane coupling agent and 10-25% of modified materials; the benzoxazine and derivative monomers thereof comprise one or the mixture of more in the following materials: dihydric phenol benzoxazine and derivatives thereof, diamine benzoxazine and derivatives thereof, naphthol benzoxazine and derivatives thereof, benzoxazine with unsaturated bonds and derivatives thereof, silicon-containing benzoxazine and derivatives thereof. The anisotropic conductive film is good in condensate compactness, small in shrinkage factor, small in coefficient of thermal expansion, low in porosity, small in internal stress, high in temperature resistance and moisture resistance, and suitable for electronic equipment used under high temperature and humidity conditions.

Description

technical field [0001] The invention belongs to the technical field of microelectronic packaging, and in particular relates to an anisotropic conductive film containing benzoxazine and a preparation method thereof. Background technique [0002] With the development of light, thin and small electronic equipment, the traditional tin-lead soldering process can no longer meet the requirements. An anisotropic conductive film that conducts in the Z direction and insulates in the X and Y directions emerges as the times require. At present, various anisotropic conductive films (ACF) have been widely used in the connection of various microcircuits, making outstanding contributions to the thinning, miniaturization, and flexibility of electronic equipment. However, with the development of the times, people have higher and higher requirements for electronic equipment, especially those used in high temperature and high humidity environments. temperature change. There are two main type...

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Problems solved by technology

In addition, the curing agent will inevitably have residues during the curing process, and these residual curing agents will greatly damage the cured product, making it not resistant to aging and shortening the service life, etc.

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