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Solving method of hydroscopic fracture of circuit board

A solution, circuit board technology, applied in printed circuits, printed circuits, printed circuit coatings, etc., can solve the problems of circuit board bursting, insufficient attention to process moisture absorption, complicated causes of bursting, etc., and achieve the effect of long life.

Inactive Publication Date: 2015-01-28
WUXI CHANGHUI ELECTROMECHANICAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The causes of cracking boards are complex. From material selection to processing, cracking boards will appear. Process moisture absorption is the focus of circuit board manufacturing. The existing technology does not pay enough attention to process moisture absorption, which leads to frequent occurrence of circuit boards due to moisture.

Method used

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Embodiment Construction

[0014] The present invention will be further explained below in combination with specific embodiments.

[0015] A solution to the hygroscopic explosion of circuit boards should pay attention to the following aspects in material selection and production:

[0016] When making the circuit board substrate, materials with low water absorption rate are used, such as halogen-free epoxy resin; the water absorption rate of halogen-free epoxy resin is lower than that of ordinary epoxy resin. The main reason is: due to the nitrogen-based epoxy resin material Nitrogen and phosphorus have fewer lone pairs of electrons than halogens, and their probability of forming hydrogen bonds with hydrogen atoms in water is lower than that of halogen materials, so the water absorption rate of their materials is lower than that of conventional halogen-based flame-retardant materials. Reducing the water absorption rate of the material can improve the reliability of the material and the stability in the P...

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PUM

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Abstract

The invention discloses a solving method of hydroscopic fracture of a circuit board. The method comprises the following steps of 1) selecting a material with lower water absorption, 2) drying and storing a prepreg and unfreezing the prepreg prior to use if the prepreg is stored in a refrigerator, 3) allowing the storage time of an inner layer board not to exceed 7 days, and 4) performing drying after preparation and spraying a conformal coating on the surface of the circuit board. The method solves the problem of the hydroscopic fracture of the circuit board.

Description

technical field [0001] The invention relates to a solution to circuit board explosion, in particular to a solution to circuit board hygroscopic explosion. Background technique [0002] In recent years, a large number of composite materials based on polymer materials have been used in electronic components and PCB circuit boards. Due to the hydrophilicity of polymer materials, electronic components, PCB circuit boards, etc. often suffer fractures and damages caused by moisture and heat. The causes of cracking boards are complex. From material selection to processing, cracking boards will appear. Process moisture absorption is the focus of circuit board manufacturing. The existing technology does not pay enough attention to process moisture absorption, which leads to frequent occurrence of circuit boards due to moisture. . Contents of the invention [0003] Purpose of the invention: the present invention solves the above problems and provides a perfect solution to the hygr...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0011H05K3/0091H05K3/227H05K2201/068
Inventor 杨彦涛
Owner WUXI CHANGHUI ELECTROMECHANICAL TECH