Non-substrate LED (Light Emitting Diode) lamp and preparation method thereof
A technology of LED lamps and LED lamp beads, which is applied in lighting and heating equipment, semiconductor devices of light-emitting elements, point light sources, etc., can solve the problems of high manufacturing cost and large usage amount, and achieve low manufacturing cost and save manufacturing cost. , The effect of saving substrate components
Active Publication Date: 2015-02-04
SINOPLAST NEW MATERIAL
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However, this patent uses high thermal conductivity insulating plastics with high manufacturing costs as the base material, and it adds selective metallization additives to the insulating plastics, which is used in a large amount
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[0036] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the accompanying drawings.
[0037] The invention discloses a substrate-less LED lamp, as attached figure 1 with 2 As shown, it includes a base 10 and a number of LED lamp beads 20 on the base 10. After the base 10 is electrostatically sprayed with a powder coating that can be selectively metallized, it is formed by laser etching and electroless plating to obtain a circuit layer 11 and a heat conduction layer 12. The pins 21 of the LED lamp bead 20 are welded on the circuit layer 11, so that the LED lamp bead 20 and the circuit layer 11 form a conductive path, and the bottom of the LED lamp bead 20 is closely attached to the heat conduction layer 12, which is convenient for heat conduction generated by the LED lamp bead 20 to the base 10, so as to realize the timely dissipation of heat. By directly disposing the circuit layer ...
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Abstract
The invention discloses a non-substrate LED (Light Emitting Diode) lamp and a preparation method thereof. The lamp comprises a pedestal and LED beads, wherein circuit layers and heat conducting layers are formed through electrostatic spraying of a selectively metallized powder coating on the pedestal and then through laser etching and chemical plating; pins of the LED beads are welded on the circuit layers, so that the LED beads and the circuit layers form a conductive path; the bottoms of the LED beads are closely attached to the heat conducting layers, so that the heat of the LED beads is conducted to the pedestal; the pedestal is formed of high-temperature-resistant polyamide composition which has the characteristics of high temperature resistance, high heat conductivity and high electric conductivity through injection molding. According to the lamp and the method, a circuit substrate is not required to be used, the circuit layers are directly formed on the pedestal, and the LED beads are directly arranged on the pedestal, so that the cost is saved.
Description
technical field [0001] The invention relates to the technical field of LED lamps, in particular to a substrate-free LED lamp with good heat dissipation effect and a preparation method thereof. Background technique [0002] With the development and maturity of LED technology, the indicators of LED are increasing day by day, and LED lighting products have been used more and more because of their long life, energy saving and environmental protection. The heat generated by a single LED lamp is relatively concentrated, and the heat generated is relatively large. Solving the heat dissipation problem is the key. [0003] However, at present, most LED lamps are welded on the aluminum substrate or ceramic substrate, and then the aluminum substrate or ceramic substrate is connected to the support. Therefore, there is a layer of aluminum substrate or ceramic substrate between the LED lamp beads and the support. . Due to the existence of the aluminum substrate or the ceramic substrat...
Claims
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IPC IPC(8): F21S2/00F21V19/00C08L77/00C08L25/18C08K13/04C08K7/14C08K3/04F21Y101/02
CPCC08K2201/001C08L77/00C08L2201/08C08L2203/20F21K9/00F21K9/90F21V19/0025C08L25/18C08K13/04C08K7/14C08K3/04F21S2/00F21V29/00
Inventor 朱怀才陈列王忠强唐雪梅钟毅文朱正红许环杰徐文明林和武
Owner SINOPLAST NEW MATERIAL