Semiconductor cooling refrigerator and hot-end heat exchange device for same

Abstract

The invention provides a semiconductor cooling refrigerator and a hot-end heat exchange device for the same. The hot-end heat exchange device comprises a hot-end heat transfer substrate, a plurality of radiation heat tubes arranged at intervals and radiating fins, wherein the hot-end heat transfer substrate is provided with a heat exchange surface in thermal connection with the hot end of a semiconductor cooling piece; each radiation heat tube is fixedly connected with the hot-end heat transfer substrate, and at least one end of each radiation heat tube is bent and extends to one side of the hot-end heat transfer substrate; the radiating fins are arranged at the parts, extending out of the hot-end heat transfer substrate, of the radiation heat tubes. According to the technical scheme, the radiation heat tubes are used for effectively conducting heat at the hot end, the radiating fins are used for enlarging the radiation area, and the characteristic that air is expanded when being heated and the density of the air is reduced is ingeniously used for automatically forming an air self-cycle to take away the heat of the fins, so that the working reliability of the semiconductor cooling piece is ensured; moreover, a machining process is convenient, and fit with a refrigerator structure is facilitated.

Description

Technical field [0001] The invention relates to refrigeration equipment, in particular to a semiconductor refrigerating refrigerator and a hot end heat exchange device. Background technique [0002] Semiconductor refrigeration refrigerators are also called thermoelectric refrigerators. It uses semiconductor refrigeration fins to realize refrigeration through heat pipe heat dissipation and conduction technology and automatic variable voltage and current control technology, without refrigeration working fluid and mechanical moving parts, and solves the application problems of traditional mechanical refrigeration refrigerators such as medium pollution and mechanical vibration. [0003] However, the cold end of the semiconductor cooling fins will generate a lot of heat at the hot end at the same time. In order to ensure the reliable and continuous operation of the semiconductor cooling fins, the hot end needs to be dissipated in time. However, in the prior art, the semiconductor refrig...

AI Technical Summary

Problems solved by technology

[0003] However, the cold end of the semiconductor refrigeration chip will generate a large amount of heat at the hot end while cooling. In order to ensure the reliable and continuous operation of the semiconductor refrigeration chip, it is necessary to dissipate heat from the hot end in time. The heat dissipation of the hot end of the fin generally adopts the scheme of forced convection cooling of the heat sink by setting the fan to improve the heat exchange efficiency, but the heat dissipation fin itself is relatively large in size, and the additional fan takes up more space in the refrigerator

After the fan is started, it will cause increased noise, and the fan will work continuously, and the reliability is also poor, which affects the comfort of the refrigerator installation environment

Images