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Manufacturing method for gold-plated circuit board

A manufacturing method and circuit board technology, which are applied in the directions of printed circuit manufacturing, printed circuit, and conductive pattern reinforcement, can solve the problems of burr energy and waste of gold-plated plates, and achieve the effects of improving etching efficiency, saving energy, and reducing burrs.

Active Publication Date: 2015-02-25
深圳市翔宇电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0021] The technical problem to be solved by the present invention is to provide a method for manufacturing a gold-plated circuit board, which solves the problem of energy waste in the process of solving the burr on the gold-plated board in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0044] A method for manufacturing a gold-plated circuit board, which sequentially includes cutting material, making inner layer graphics, pressing, drilling, milling grooves, first copper plating, first milling, second copper plating, second milling, internal Layer pattern etching, outer layer pattern making, pattern electroplating copper nickel gold, outer layer pattern etching, solder resist, surface treatment process, wherein, the thickness of copper in the first copper plating process is the same as that in the second copper plating process. Both the inner layer graphics and the outer layer graphics are made by dry film exposure and development.

[0045] The phenomenon points during the development account for 50% of the total length of the development, and the temperature during the development is 32°C.

[0046] Both the inner layer pattern etching and the outer layer pattern etching use acidic etching solution.

[0047] The acidic etching solution is copper chloride sol...

specific Embodiment 2

[0051] A method for manufacturing a gold-plated circuit board, which sequentially includes cutting material, making inner layer graphics, pressing, drilling, milling grooves, first copper plating, first milling, second copper plating, second milling, internal Layer pattern etching, outer layer pattern making, pattern electroplating copper nickel gold, outer layer pattern etching, solder resist, surface treatment process, wherein, the thickness of copper in the first copper plating process is the same as that in the second copper plating process. Both the inner layer graphics and the outer layer graphics are made by dry film exposure and development.

[0052] Both the inner layer graphics and the outer layer graphics are made by dry film exposure and development.

[0053]The phenomenon points during the development account for 70% of the total length of the development, and the temperature during the development is 28°C.

[0054] Both the inner layer pattern etching and the ou...

specific Embodiment 3

[0060] A method for manufacturing a gold-plated circuit board, which sequentially includes cutting material, making inner layer graphics, pressing, drilling, milling grooves, first copper plating, first milling, second copper plating, second milling, internal Layer pattern etching, outer layer pattern making, pattern electroplating copper-nickel-gold, outer pattern etching, solder resist, and surface treatment processes, wherein the thickness of copper in the first copper plating process is the same as that in the second copper plating process. Both the inner layer graphics and the outer layer graphics are made by dry film exposure and development.

[0061] Both the inner layer graphics and the outer layer graphics are made by dry film exposure and development.

[0062] The phenomenon points during the development account for 60% of the total length of the development, and the temperature during the development is 30°C.

[0063] Both the inner layer pattern etching and the ou...

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Abstract

The invention discloses a manufacturing method for a gold-plated circuit board. The method includes the procedures of rough shape cutting, inner-layer graph manufacturing, laminating, drilling, groove milling, primary copper deposition and electroplating, primary milling, secondary copper deposition and electroplating, secondary milling, inner-layer graph etching, outer-layer graph manufacturing, copper, nickel and gold electroplating on a graph, outer-layer graph etching, solder masking and surface treatment, wherein the thickness of copper in the primary copper deposition and electroplating is identical with that in the secondary copper deposition and electroplating. The method has the advantages that a copper deposition and electroplating procedure and a one-time milling procedure in the prior art are divided into the primary copper deposition and electroplating procedure, the primary milling procedure, the secondary copper deposition and electroplating procedure and the secondary milling procedure, the number of burrs in the procedures is effectively reduced, waste in the intermediate process is avoided, and therefore energy is saved substantially.

Description

technical field [0001] The invention belongs to the production field of circuit boards, and in particular relates to a method for manufacturing a gold-plated circuit board. Background technique [0002] The traditional gold-plated circuit board production process is as follows: [0003] 1. Cutting: According to the requirements of the engineering data MI, cut the large sheets that meet the requirements into small pieces for production, and meet the requirements of the customer. The process: large sheets→cut sheets according to MI requirements →Curium board→Beer fillet\edge grinding→Out of the board. [0004] 2. Drilling: According to the engineering data (customer data), drill the desired hole diameter at the corresponding position on the sheet that meets the required size. The process: stacking plate pins → upper plate → drilling → lower plate → inspection\ repair. [0005] 3. Copper immersion: Copper immersion is to deposit a thin layer of copper on the wall of the insu...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/24
Inventor 沈智广
Owner 深圳市翔宇电路有限公司
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