Manufacturing method of tungsten target

Abstract

Disclosed is a manufacturing method of a tungsten target. The manufacturing method of the tungsten target comprises providing a tungsten target blank, wherein the tungsten target blank comprises a sputtering surface and a back surface; rough-grinding the sputtering surface and the back surface through a diamond grinding wheel; performing accurate semi-grinding on the sputtering surface and the back surface through the diamond grinding wheel; performing accurate grinding on the sputtering surface through the diamond grinding wheel. The manufacturing method of the tungsten target can reduce or avoid edge failure of the tungsten target blank during the machining process to obtain the tungsten target high in dimensional precision, low in surface roughness and capable of meeting the sputtering performance, and meanwhile, can reduce losses of tools during the machining process of the tungsten target blank and further reduce the machining cost of the tungsten target.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for manufacturing a tungsten target Background technique [0002] Vacuum sputtering is a process in which electrons accelerate to the substrate under the action of an electric field and collide with argon atoms, ionizing a large number of argon ions and electrons. Among them, the electrons fly to the substrate, and the argon ions are accelerated under the action of an electric field. Bombard the target, the target is composed of the target and the back plate supporting the target, a large number of target atoms are sputtered out, and the neutral target atoms (or molecules) are deposited on the substrate to form a film, and finally the substrate The purpose of coating the surface of the sheet. [0003] Large-scale integrated circuits often use tungsten targets for vacuum sputtering. Tungsten has the following mechanical and physical properties: Tungsten is a re...

AI Technical Summary

Problems solved by technology

However, in the process of processing, due to the stress, the tungsten target blank is prone to corner drop during processing, and the surface of the formed tungsten target is rough, which affects the sputtering effect of the subsequent sputtering process, and even discharges. Damage to the coated substrate

Moreover, due to the high hardness of tungsten, serious tool wear and frequent tool breakage, the production cost of tungsten targets is too high

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