Manufacturing method of tungsten target

Abstract

Disclosed is a manufacturing method of a tungsten target. The manufacturing method of the tungsten target comprises providing a tungsten target blank, wherein the tungsten target blank comprises a sputtering surface and a back surface; rough-grinding the sputtering surface and the back surface through a diamond grinding wheel; performing accurate semi-grinding on the sputtering surface and the back surface through the diamond grinding wheel; performing accurate grinding on the sputtering surface through the diamond grinding wheel. The manufacturing method of the tungsten target can reduce or avoid edge failure of the tungsten target blank during the machining process to obtain the tungsten target high in dimensional precision, low in surface roughness and capable of meeting the sputtering performance, and meanwhile, can reduce losses of tools during the machining process of the tungsten target blank and further reduce the machining cost of the tungsten target.

Description

Technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a manufacturing method of a tungsten target Background technique [0002] In vacuum sputtering, electrons collide with argon atoms in the process of accelerating to the substrate under the action of an electric field, and ionize a large number of argon ions and electrons. Among them, the electrons fly to the substrate and the argon ions are accelerated under the action of the electric field. Bombardment of the target, the target is composed of a target material and a back plate supporting the target material. A large number of target material atoms are sputtered. The neutral target material atoms (or molecules) are deposited on the substrate to form a film, and finally reach the substrate The purpose of film surface coating. [0003] Large-scale integrated circuits often use tungsten targets for vacuum sputtering. Tungsten has the following mechanical and physical properties:...

AI Technical Summary

Problems solved by technology

However, in the process of processing, due to the stress, the tungsten target blank is prone to corner drop during processing, and the surface of the formed tungsten target is rough, which affects the sputtering effect of the subsequent sputtering process, and even discharges. Damage to the coated substrate

Moreover, due to the high hardness of tungsten, serious tool wear and frequent tool breakage, the production cost of tungsten targets is too high

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