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Novel technology and equipment for preparing various functional and structural thin films at high speed

A high-speed, functional technology, applied in the field of coating and surface processing, can solve the problems of reducing the activation energy of the reaction between raw material molecules and slow deposition rate, and achieve the effect of high raw material utilization and precise control

Inactive Publication Date: 2015-03-18
赵培
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Problems solved by technology

[0004] The purpose of the present invention is to provide a new technology and equipment for high-speed preparation of various functional and structural thin films, so as to solve many problems in the large-scale preparation of various thin films by conventional chemical vapor deposition, so that large Accurate, stable and continuous preparation of various oxide and non-oxidized films on a large scale
[0005] Aiming at the problem that the deposition rate of the conventional chemical vapor deposition method is slow, the solution of the patent of the present invention is: by introducing the laser into the reaction chamber to irradiate the surface of the substrate, the activation energy of the reaction between the raw material molecules can be greatly reduced, so that it can be processed at a very high rate. Preparation of various oxide and non-oxide thin films

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  • Novel technology and equipment for preparing various functional and structural thin films at high speed

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Embodiment approach

[0016] When the equipment is running, the reaction chamber 15 will reduce the pressure of the chamber 15 to the required value under the action of the vacuum pump 17 to provide necessary conditions for the smooth progress of the reaction.

[0017] The liquid raw material in the liquid raw material tank 1 is extracted by the liquid raw material conveying part 3 through the liquid raw material extraction pipe 2, and is continuously and stably sent to the pressure chamber 5 through the liquid raw material conveying pipe 4. The gas in the carrier gas storage tank 6 generates pressure in the pressure chamber 5, and quickly presses out the liquid raw material that has been pressed into the pressure chamber 5, and the liquid raw material is thus atomized into small droplets. When the atomized small droplets are sprayed to the wall of the spray atomization-multiple eutectoid volatilization chamber 7, the solvent in the small droplets volatilizes quickly due to the thermal effect of the vo...

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Abstract

The invention relates to equipment for preparing functional and structural thin films by using a spray-liquid atomizing-multielement eutectoid laser induced chemical vapor deposition method. According to the equipment, a liquid raw material supply system is introduced to replace a solid raw material heating tank which is used by the conventional chemical vapor deposition equipment, so that the problems that the conventional chemical vapor deposition method cannot provide accurate, stable and continuous raw material steam for a long time and the thin film components in the multielement thin film preparation process cannot be accurately controlled and the like can be effectively solved. On the basis, the reaction activation energy among vapor raw material molecules can be reduced to a great extent so as to improve the chemical reaction rate by adopting a method of laser radiation of a surface of a basal plate. Therefore, various oxides and non-oxidized thin films can be accurately, stably and continuously prepared on a large scale at the maximum rate.

Description

1. Technical Field: [0001] The invention is a technology and equipment for preparing thin films with various functions and structures by using a spray atomization-multiple eutectoid laser chemical vapor deposition method, and belongs to the technical field of surface processing and coating in new material technology. 2. Background technology: [0002] The chemical vapor deposition method has the advantages of simple preparation process, low cost, uniform deposition, and high product performance. Therefore, it has great practical prospects in large-scale production of films with various functions and structures. However, from the perspective of industrial application, the deposition rate using conventional chemical vapor deposition is still relatively low, resulting in relatively low production efficiency. Therefore, how to increase the deposition rate of the conventional chemical vapor deposition method has become an important consideration for improving production efficiency and...

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Application Information

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IPC IPC(8): C23C16/448C23C16/455C23C16/46C23C16/48
CPCC23C16/4485C23C16/45578C23C16/483
Inventor 不公告发明人
Owner 赵培
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