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Novel low-melting-point lead-free solder

A technology of lead-free solder and low melting point, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc. , Difficulty and other problems, to achieve the effect of excellent thermal shock resistance, low cost, and reduce difficulty

Inactive Publication Date: 2015-03-25
YIK SHING TAT INDUSTRIALCO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a new type of lead-free solder with a low melting point, which solves the problem that the current lead-free solder has a high melting point and is difficult to reflow, and is not suitable for the development trend of light, thin, short, and miniaturized electronic products. And the problem of high energy consumption

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Embodiment Construction

[0018] A new type of low-melting point lead-free solder provided by this specific embodiment, the mass percent of its chemical composition is: 0.3-3.5% Ag, 0.3-0.7% Cu, 0.8-6.0% Bi, 0.1-0.6% Ni , 0.01%-0.15% of rare earth metals, the balance is Sn.

[0019] We found that adding element Bi to Sn-Ag-Cu lead-free solder can lower the melting point of the solder and reduce the surface tension; at the same time, the addition of Bi also slows down the reaction speed of Sn and Cu, making the wettability of the solder worse. better. However, a large amount of Bi used in the alloy has a great influence on the mechanical properties of the alloy, and it is easy to produce tin partiality, which makes the interface layer of the alloy unstable, and eventually leads to poor reliability of solder joints. Therefore, the Bi content in the alloy should not be too high, 0.8-6.0% is a more suitable ratio, and in the preferred technical solution, 1.0-5.0% is a more suitable ratio.

[0020] In add...

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Abstract

The invention discloses novel low-melting-point lead-free solder. The chemical material of the novel low-melting-point lead-free solder comprises, by mass, 0.3-3.5% of Ag, 0.3-.7% of Cu, 0.8-6.0% of Bi, 0.1-0.6% of Ni, 0.01-0.15% of rare earth metal, and the balance Sn. The novel low-melting-point lead-free solder is low in cost and has wet property, welding spot reliability, spreading property and heat shock resistance and other excellent performance. Above all, the novel low-melting-point lead-free solder is low in melting point, the difficulty of reflow soldering can be reduced, the novel low-melting-point lead-free solder is particularly suitable for the development tendency of light, thin, short and minimized electronic products currently, and energy conservation, emission reduction and energy consumption reduction are facilitated.

Description

technical field [0001] The invention relates to alloy solder, in particular to a novel lead-free solder with low melting point suitable for wave soldering and reflow soldering. The solder does not contain lead and has a low melting point. While reducing soldering energy, it also meets the requirements of soldering performance, mechanical performance, and electrical performance required by high-performance solder. Background technique [0002] The traditional solder in the past is tin-lead solder, which has been widely used in the past because of its low melting point, excellent solderability, and low cost. With the rapid development of electronic technology, the replacement time of electronic products is shortened day by day, resulting in a large amount of electronic product waste. Printed circuit boards, removed from disassembled electronics, are often shredded and buried in the ground. If the rainwater seeps into the ground and touches the buried electronic circuit board...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 吴建雄吴建新徐金华
Owner YIK SHING TAT INDUSTRIALCO LTD
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