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Latent curing system used for moulding prepregs at medium or low temperature and method for preparing latent curing system

A latent curing agent and prepreg technology, applied in the field of composite materials, can solve the problems of complex process, serious energy consumption, and difficulty in industrialized production of modified latent curing agents and room temperature reactive curing agents. The effect of industrialized production, less human injury and good mechanical properties

Active Publication Date: 2015-03-25
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the disadvantages of modified latent curing agent and room temperature reactive curing agent, such as complicated process, difficult industrial production, and serious energy consumption, the present invention provides a latent curing system for medium and low temperature molding prepregs and a preparation method thereof

Method used

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  • Latent curing system used for moulding prepregs at medium or low temperature and method for preparing latent curing system
  • Latent curing system used for moulding prepregs at medium or low temperature and method for preparing latent curing system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Weigh 500g of dicyandiamide and 400g of aliphatic amine and place them in a reaction kettle, stir vigorously until the dicyandiamide and aliphatic amine are mixed evenly, add 100g of phenyl glycidyl ether and 10g of 2-methylimidazole, and react at 60°C for 6h , After cooling the product, a white pasty liquid is obtained, which is a latent curing system for medium and low temperature molding prepregs.

[0022] Weigh 50g of the above-prepared latent curing system for low-temperature molding prepreg and 500g of epoxy resin E-44, stir them evenly, pour them into the spline mold, and cure at 80°C for 8h to prepare the cast body spline. The properties of the latent curing system for medium and low temperature molding prepregs are shown in Table 1, and the properties of the cast body are shown in Table 2.

Embodiment 2

[0024] Weigh 800g of modified dicyandiamide and 600g of alicyclic amine and place them in a reaction kettle, stir vigorously until the modified dicyandiamide and alicyclic amine are mixed evenly, then add 300g of bisphenol A glycidyl ether and 50g of 2-ethyl - 4-Methylimidazole, react at 80°C for 4 hours, and cool the product to obtain a white paste liquid, which is a latent curing system for medium and low temperature molding prepregs.

[0025] Weigh 62.5g of the above-prepared latent curing system for low-temperature molding prepreg and 500g of epoxy resin E-44, stir them evenly, pour them into the spline mold, and cure at 90°C for 6h to prepare the cast body spline. The properties of the latent curing system for medium and low temperature molding prepregs are shown in Table 1, and the properties of the cast body are shown in Table 2.

Embodiment 3

[0027] Weigh 1000g of urea derivatives and 800g of polyetheramine respectively and put them in the reaction kettle, stir vigorously until the urea derivatives and polyetheramine are mixed evenly, then add 500g of bisphenol F glycidyl ether and 100g of 1-benzyl-2 - Ethylimidazole, react at 100°C for 2 hours, and the product is cooled to obtain a white paste liquid, which is a latent curing system for medium and low temperature molding prepregs.

[0028] Weigh 75g of the above-prepared latent curing system for low-temperature molding prepreg and 500g of epoxy resin E-44, stir them evenly, pour them into a spline mold, and cure at 100°C for 4 hours to prepare a cast body spline. The properties of the latent curing system for medium and low temperature molding prepregs are shown in Table 1, and the properties of the cast body are shown in Table 2.

[0029] Table 1 Properties of latent curing system for medium and low temperature molding prepregs

[0030]

[0031] Table 2 C...

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Abstract

The invention belongs to the field of composite material, and specifically discloses a latent curing system used for moulding prepregs at a medium or low temperature and a method for preparing the latent curing system. The latent curing system comprises 10-50 parts of epoxy resin, 50-100 parts of a latent curing agent, 40-80 parts of a liquid room-temperature reactive curing agent, and 1-10 parts of an accelerant. The preparation method comprises the following steps: uniformly mixing the latent curing agent and the liquid room-temperature reactive curing agent; adding epoxy resin and the accelerant to carry out a reaction at the temperature of 60 to 100 DEG C for 2-6 hours; and finally obtaining a paste liquid that is the latent curing system used for moulding prepregs at a medium or low temperature. According to the invention, the latent curing system is used for moulding at a medium or low temperature, the curing temperature of the latent curing agent is reduced, and the pasty form is beneficial to uniformly dispersing the latent curing system in the epoxy. The latent curing system is simple in operation of preparation technology and is suitable for large-scale industrial production.

Description

technical field [0001] The invention belongs to the field of composite materials, and in particular relates to a latent curing system for medium and low temperature molding prepregs and a preparation method thereof, which can be applied to the preparation of the resin system for medium and low temperature curing prepregs and the prepregs. Background technique [0002] Advanced composite materials have the advantages of high performance and good designability, so they are often used in large material components such as wind turbine blades and automotive fields. In the curing process of large-scale composite material components, due to the large size of the mold used, high-temperature curing will not only generate large residual internal stress, affect the dimensional accuracy of the product, but also cause large energy consumption, so the preparation of large-scale Composite components often adopt medium and low temperature curing process (curing at 80~100°C). However, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50
Inventor 李刚刘毅彬杨小平
Owner BEIJING UNIV OF CHEM TECH
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