Method for evaluating material sub-surface machining damage layer thickness

Abstract

The invention belongs to the technical field of material surface machining quality evaluation and in particular relates to a method for evaluating material sub-surface machining damage layer thickness. By utilizing an indentation test, the sub-surface damage layer thickness is evaluated by virtue of a displacement change rule generated by a pressure head under the actions of different loads; when the increment of the maximum displacement value of the selected load is greater than 50 percent compared with the maximum displacement value of the previous load, the maximum displacement value generated by the selected load is the evaluation value of the sub-surface damage layer thickness; the increment of the selected load can be changed according to the requirements of different processes, so that the accuracy of the evaluation value of the sub-surface damage layer thickness is adjusted; and the evaluation value of the sub-surface damage layer thickness is determined in the shortest time. With the adoption of the method, the value of the sub-surface damage layer thickness is evaluated, although an accurate value of the sub-surface damage layer thickness cannot be obtained and a certain damage of the material surface is generated, indentation in a micrometer scale is generated on the material surface only, the damage degree is obviously smaller than that in a corroding and sectioning method, and destruction of the environment is not caused.

Description

technical field [0001] The invention belongs to the technical field of material surface processing quality evaluation, and in particular relates to a method for evaluating the thickness of a material subsurface processing damage layer. Background technique [0002] With my country's increasing requirements for high-precision processing in the fields of energy, space, national defense equipment, and integrated circuits, the evaluation of the surface processing integrity of various precision components is the basis for meeting the increasing technical indicators. Surface integrity evaluation mainly includes surface roughness, surface profile and thickness of subsurface damage layer. At present, there are many methods for quality evaluation of surface roughness and surface profile, such as surface roughness meter and surface profiler. The evaluation of sub-surface processing quality can be mainly divided into two types: damage detection and non-damage detection. [0003] At p...

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Problems solved by technology

[0007] The technical problem to be solved in the present invention is to overcome the deficiencies of the prior art and provide a method for evaluating the thickness of the subsurface processing damage layer that is less destructive to samples or the environment in view of the current situation that the thickness of the subsurface damaged layer of the material is not difficult to detect without damage.

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