Thick copper circuit board with inconsistent inner and outer layer copper thickness and preparation method thereof

A technology of thick copper circuit board, inner and outer layers, applied in multilayer circuit manufacturing, printed circuit manufacturing, removing conductive materials by chemical/electrolytic methods, etc., can solve the problems of obvious barrier effect, bubble pressing, uneven heat transfer, etc. , to achieve the effect of good filling effect, no bubbles in pressing, and uniform pressure distribution.
CN104486914BActive Publication Date: 2017-12-05KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
Publication Date
2017-12-05

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Abstract

The invention discloses an inner and outer layer copper thickness-differentiated thick copper circuit board and a preparation method thereof and belongs to the PCB technical field. The method includes the steps of board pressing process, drilling process and etching process. According to the board pressing process, a prepreg of which the resin content is equal to or larger than 65% is selected; hot pressing process and cold pressing process are sequentially adopted to perform board pressing; the parameter conditions of the hot pressing process are as follows: pressure ranges from 250 to 450 PSI, temperature ranges from 175 to 220 DEG C, vacuum degree ranges from 0 to 68 cm Hg, and time ranges from 90 to 150 min; and the parameter conditions of the cold pressing process are as follows: pressure ranges from 50 to 450 PSI, temperature ranges from 165 to 220 DEG C, and time ranges from 130 to 230 min. According to the preparation method, a laminated structure and a board lamination mode are adopted, and temperature rising and pressurization control are utilized in cooperation, and therefore, the filling of flowing resin can be uniform, and pressure distribution is uniform when board pressing is performed, and an excellent filling effect can be realized, and air bubble generation can be avoided, and press fit can be excellently realized.
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Description

technical field

[0001] The invention relates to the technical field of PCB printed circuit boards, in particular to a thick copper circuit board with inconsistent inner and outer copper thicknesses and a preparation method thereof. Background technique

[0002] Automotive electronic components, especially in high-power and high-voltage parts such as engine power supply parts and automotive central electrical power supply parts, often use thick copper circuit boards with inconsistent inner and outer copper thicknesses (such as outer layer 6OZ, inner layer 12OZ thick copper circuit boards, etc.) ), the circuit is required to have high reliability characteristics such as heat aging resistance and low temperature cycle resistance.

[0003] In the conventional technology, the pressing process of the above-mentioned thick copper circuit board with inconsistent inner and outer layer copper thickness is to laminate the copper foil, prepreg and oxidized inner layer board in order and...

Claims

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