Thick copper circuit board with inconsistent inner and outer layer copper thickness and preparation method thereof
A technology of thick copper circuit board, inner and outer layers, applied in multilayer circuit manufacturing, printed circuit manufacturing, removing conductive materials by chemical/electrolytic methods, etc., can solve the problems of obvious barrier effect, bubble pressing, uneven heat transfer, etc. , to achieve the effect of good filling effect, no bubbles in pressing, and uniform pressure distribution.
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Embodiment 1
[0064] A method for preparing a thick copper circuit board (inner layer 12OZ, outer layer 6OZ thick copper board) with inconsistent copper thicknesses on the inner and outer layers, the circuit board adopts a four-layer structure, wherein the first and fourth circuit layers use 6OZ thick copper foil 12OZ thick copper foil is used for the second and third circuit layers, and the board thickness is 65-81mil.
[0065] The preparation method of this embodiment includes the steps of plate pressing, drilling and etching, and the other steps are prepared according to conventional methods. in:
[0066] (1) In the pressing process, the 1080 prepreg with a resin content of 68% is selected, and the hot pressing process and the cold pressing process are used for pressing in turn; the specific process parameters are shown in the table below.
[0067] Table 1. Setting of pressing plate process parameters
[0068]
[0069]
[0070] In the above-mentioned cold pressing process, the co...
Embodiment 2
[0077] A method for preparing a thick copper circuit board (inner layer 12OZ, outer layer 6OZ thick copper board) with inconsistent copper thicknesses on the inner and outer layers, the circuit board adopts a four-layer structure, wherein the first and fourth circuit layers use 6OZ thick copper foil 12OZ thick copper foil is used for the second and third circuit layers, and the board thickness is 65-81mil.
[0078] The preparation method of this embodiment includes the steps of plate pressing, drilling and etching, and the other steps are prepared according to conventional methods. in:
[0079] (1) In the pressing process, the 1080 prepreg with a resin content of 71% is selected, and the hot pressing process and the cold pressing process are used for pressing in turn; the specific process parameters are shown in the table below.
[0080] Table 3. Setting of pressing plate process parameters
[0081]
[0082] (2) In the drilling process, the board is baked at 120°C for 6 h...
Embodiment 3
[0088] A method for preparing a thick copper circuit board (inner layer 12OZ, outer layer 6OZ thick copper board) with inconsistent copper thicknesses on the inner and outer layers, the circuit board adopts a four-layer structure, wherein the first and fourth circuit layers use 6OZ thick copper foil 12OZ thick copper foil is used for the second and third circuit layers, and the board thickness is 65-81mil.
[0089] The preparation method of this embodiment includes the steps of plate pressing, drilling and etching, and the other steps are prepared according to conventional methods. in:
[0090] (1) In the pressing process, the 1080 prepreg with a resin content of 65% is selected, and the hot pressing process and the cold pressing process are used for pressing in turn; the specific process parameters are shown in the table below.
[0091] Table 5. Setting of pressing plate process parameters
[0092]
[0093] (2) In the drilling process, bake the board at 160°C for 4 hours...
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