Flip LED (light-emitting diode) chip with high luminous efficiency and good heat radiating performance and preparation method thereof

Abstract

The invention provides a flip LED (light-emitting diode) chip with high luminous efficiency and good heat radiating performance and a preparation method thereof. The LED chip comprises an epitaxial substrate, wherein an N type epitaxial layer, a light-emitting layer and a P type epitaxial layer are sequentially laminated on the upper surface of the epitaxial substrate; a concave hole is formed in the P type epitaxial layer, downwards penetrates through the light-emitting layer and extends to the N type epitaxial layer; a P contact metal layer, a P baffle protecting layer and a P surface electrode layer are sequentially laminated on the upper surface of the P type epitaxial layer; the lower surface of the P baffle protecting layer and the upper surface of the P contact metal layer are overlapped; an N contact metal layer and an N surface electrode layer are sequentially laminated on the upper surface of the N type epitaxial layer corresponding to the bottom of the concave hole; a clearance is reserved between the N contact metal layer and the edge of the concave hole; an insulating layer is arranged on the wall surface of the clearance. The flip LED chip provided by the invention has high heat-conducting property and conductivity, and improvement of the luminous efficiency of the LED chip is facilitated by the structure.

Description

technical field [0001] The invention belongs to the field of manufacturing light-emitting devices, and relates to a light-emitting diode chip with a flip-chip structure and a manufacturing method thereof. Background technique [0002] Light-emitting diode (LED) light sources have the advantages of high efficiency, long life, and no harmful substances such as Hg. With the rapid development of LED technology, the brightness and lifespan of LEDs have been greatly improved, making the application of LEDs more and more extensive. From outdoor lighting such as street lights to urban lighting such as decorative lights, they are all used or Replace with LED as light source. [0003] In the semiconductor lighting industry, the structure of LED chips is generally divided into three types: front chip structure, vertical chip structure and flip chip structure. Compared with the other two chip structures, the flip chip structure has the advantages of good heat dissipation performance, ...

AI Technical Summary

Problems solved by technology

[0005] The existing method of making flip-chip LED chips has six main steps, and each step uses a photolithography process, which leads to high production costs due to numerous manufacturing processes

Moreover, due to the limitation of photolithography accuracy, multiple photolithography will cause deviations in the chip pattern, the more times of photolithography, the greater the deviation

Moreover, the structure of the flip-chip LED chip prepared by the above-mentioned existing process still has some shortcomings, and its electrical and thermal conductivity needs to be further improved.

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