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PCB (printed circuit board) buffing wheel production method

A technology for printed circuit boards and polishing wheels, which is applied in the direction of grinding/polishing equipment, manufacturing tools, metal processing equipment, etc., can solve the problems that polishing wheels are difficult to meet the above requirements at the same time, and achieve good grinding effect, strong adhesion, and surface Uniform roughness effect

Inactive Publication Date: 2015-04-15
DONGGUAN GOLDEN SUN ABRASIVES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the existing PCB polishing wheels are difficult to meet the above requirements at the same time

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Embodiment one, a kind of preparation method of PCB printed circuit board buffing wheel comprises following process steps, specifically:

[0018] a, prepare the steel roller core;

[0019] b. An adhesive layer is evenly coated on the outer peripheral wall of the steel roller core, wherein the adhesive forming the adhesive layer is formed by mixing three materials of epoxy resin, curing agent and reinforcing filler, and epoxy resin, curing agent and reinforcing filler are three The weight ratio of the materials is: 10:12:3;

[0020] c. Press the cut scouring pad sheet tightly on the outer surface of the adhesive layer, and bond the scouring pad sheet to the adhesive layer;

[0021] d. After the scouring pads are pressed together, dry the polishing wheel formed by bonding the steel roller core and the scouring pads.

[0022] It needs to be further explained that the curing agent used in the first embodiment is polyamine curing agent, imidazole curing agent, acid anhydri...

Embodiment 2

[0025] Embodiment two, a kind of preparation method of PCB printed circuit board buffing wheel comprises following process steps, specifically:

[0026] a, prepare the steel roller core;

[0027] b. An adhesive layer is evenly coated on the outer peripheral wall of the steel roller core, wherein the adhesive forming the adhesive layer is formed by mixing three materials of epoxy resin, curing agent and reinforcing filler, and epoxy resin, curing agent and reinforcing filler are three The weight ratio of the materials is: 10:10:2;

[0028] c. Press the cut scouring pad sheet tightly on the outer surface of the adhesive layer, and bond the scouring pad sheet to the adhesive layer;

[0029] d. After the scouring pads are pressed together, dry the polishing wheel formed by bonding the steel roller core and the scouring pads.

[0030] It needs to be further explained that the curing agent used in the second embodiment is a polyamine curing agent, an imidazole curing agent, an aci...

Embodiment 3

[0033] Embodiment three, a kind of preparation method of PCB printed circuit board buffing wheel comprises following process steps, specifically:

[0034] a, prepare the steel roller core;

[0035] b. An adhesive layer is evenly coated on the outer peripheral wall of the steel roller core, wherein the adhesive forming the adhesive layer is formed by mixing three materials of epoxy resin, curing agent and reinforcing filler, and epoxy resin, curing agent and reinforcing filler are three The weight ratio of the materials is: 10:15:4;

[0036] c. Press the cut scouring pad sheet tightly on the outer surface of the adhesive layer, and bond the scouring pad sheet to the adhesive layer;

[0037] d. After the scouring pads are pressed together, dry the polishing wheel formed by bonding the steel roller core and the scouring pads.

[0038] It needs to be further explained that the curing agent used in the third embodiment is polyamine curing agent, imidazole curing agent, acid anhyd...

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PUM

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Abstract

The invention discloses a PCB buffing wheel production method. The method includes the steps of steel roll core production, an adhesive layer coating, clean cloth piece pressing and drying. An adhesive of the adhesive layer is made by mixing epoxy resin, a curing agent and reinforcing filler in the weight ratio of 10: 10-15: 2.0-4.0. A PCB buffing wheel produced through the method is good in buffing effect and long in service life. And a PCB produced with the PCB buffing wheel is uniform in surface roughness, high in light sensitive film and green oil film adhesion and capable of significantly reducing defects of short circuit and open circuit.

Description

technical field [0001] The invention relates to the technical field of PCB printed circuit board processing devices, in particular to a preparation method of a PCB printed circuit board polishing wheel. Background technique [0002] In the PCB printed circuit board processing industry, the formed PCB printed circuit board must be processed by the corresponding PCB printed circuit board polishing wheel; in order to ensure the surface processing quality of the PCB printed circuit board, the PCB printed circuit board polishing wheel Preparation and structural design are particularly important. [0003] For PCB printed circuit boards, PCB printed circuit boards treated by PCB printed circuit board polishing wheels require uniform surface roughness, and can ensure the stable attachment of photosensitive film and green oil film. In addition, it is necessary to avoid short circuit and open circuit as much as possible. and other defects; at the same time, the PCB printed circuit bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00
CPCB24D18/0072
Inventor 方红农忠超卞振伟
Owner DONGGUAN GOLDEN SUN ABRASIVES
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