Lead-free copper-based amorphous solder strip

A technology of lead-free copper base and brazing material, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of alloy brittleness, low strength and toughness, and inability to make strips, etc.

Inactive Publication Date: 2015-04-29
刘桂芹
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the existence of P element in the existing copper-based brazing material, the alloy is very brittle, and its strength and toughness are not high, so it cannot be made into strips, which limits its application.

Method used

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Examples

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Embodiment Construction

[0011] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0012] The lead-free copper-based amorphous solder of the present invention includes P element, Bi element, Sn element, Zn element, Ce element, and Cu element, and the total mass percentage of the lead-free copper-based amorphous solder is 100%, wherein , 0.02%≤P≤0.06%, 0.02%≤Bi≤0.06%, 4.0%≤Sn≤6.8%, 13.5%≤Zn≤14.3%, 0.15%≤Ce≤0.22%, 71%≤Cu≤83%, Yu The amount is impurity. For the harm of P element in existing brazing material, it is impossible to completely eradicate P element. Therefore, the present invention adds Bi element, and Bi element and P element form (Sn-9Zn0.05Ce)xBi and other elements respectively. (Sn-9Zn0.05Ce)...

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PUM

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Abstract

The invention discloses a lead-free copper-based amorphous solder strip, which is prepared from lead-free copper-based amorphous solder. Based on the total mass of 100 percent, the lead-free copper-based amorphous solder comprises the following components in percentage by mass: more than or equal to 0.02 percent and less than or equal to 0.06 percent of P, more than or equal to 0.02 percent and less than or equal to 0.06 percent of Bi, more than or equal to 4.0 percent and less than or equal to 6.8 percent of Sn, more than or equal to 13.5 percent and less than or equal to 14.3 percent of Zn, more than or equal to 0.15 percent and less than or equal to 0.22 percent of Ce, more than or equal to 71 percent and less than or equal to 83 percent of Cu and the balance of impurities. According to the lead-free copper-based amorphous solder strip, Bi is added, meanwhile, Cu is completely eliminated, and results obtained by analyzing the microstructure morphology of the lead-free copper-based amorphous solder strip and testing the tensile strength, the percentage elongation after fracture and the Vickers hardness of the lead-free copper-based amorphous solder strip show that by the addition of Bi, the tensile strength and the hardness of the lead-free copper-based amorphous solder strip can be remarkably improved and a needlelike or granular zinc-rich phase can be promoted to be separated from the solder.

Description

technical field [0001] The invention relates to a brazing material, in particular to a lead-free copper-based amorphous brazing material strip. Background technique [0002] At present, known brazing materials are mainly divided into three types: silver-based, nickel-based, and copper-based. Silver-based brazing material has high silver content, moderate and stable melting point, excellent permeability and fluidity, good strength and toughness after welding, and excellent thermal and electrical conductivity. It has been widely used in the welding of workpieces with small contact surfaces; and its surface color is light after brazing, which can be applied to the processing of silver jewelry, glasses and other industries. Nickel-based brazing materials are used in the welding of high-temperature alloys and stainless steel parts (such as aviation parts, automobile and ship parts, cooking utensils, medical equipment, etc.). The copper-based brazing material is mainly used to r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30
CPCB23K35/302B23K35/40
Inventor 刘桂芹
Owner 刘桂芹
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