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Attenuation reduction structure for high frequency signal contact pads of circuit board

一种高频信号、连接垫的技术，应用在电气连接印刷元件、印刷电路、印刷电路等方向，能够解决缺少解决方法高频信号传送等问题，达到降低电容效应的效果

Active Publication Date: 2015-04-29
ADVANCED FLEXIBLE CIRCUITS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at the connection between the high-frequency signal line and the connection pad layout section arranged on the flexible circuit board and the adjacent area, due to the line width (very small line width) of the high-frequency signal line and the signal guide pin of the connector And component size specifications (relative to the line width of the signal line has a larger size), so far, practitioners in this technical field still lack effective solutions to ensure the quality of high-frequency signal transmission

Method used

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  • Attenuation reduction structure for high frequency signal contact pads of circuit board
  • Attenuation reduction structure for high frequency signal contact pads of circuit board
  • Attenuation reduction structure for high frequency signal contact pads of circuit board

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Embodiment Construction

[0063] see figure 1 and figure 2 The circuit board 100 according to the first embodiment of the present invention has a circuit layout surface 11 and a ground wire layout surface 21, and a connection pad layout section A and a connection pad layout section A corresponding to the connection pad layout section A are provided on the circuit layout surface 11. Corresponding section B of . The structure of the circuit board 100 in this embodiment includes a first substrate 1, a second substrate 2, an adhesive layer 3, a ground layer 4, a plurality of high-frequency signal connection pads 14 and a plurality of high-frequency signal lines 15 .

[0064] The first substrate 1 has a circuit layout surface 11 and a first bonding surface 12, wherein the circuit layout surface 11 defines a connection pad layout section A and a first extension extending from the connection pad layout section A. Section 13.

[0065] A plurality of high-frequency signal connection pads 14 are arranged ad...

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Abstract

An attenuation reduction structure of a circuit board includes an expanded thickness formed between high frequency signal contact pads and a grounding layer of the circuit board. The expanded thickness is greater than a reference thickness between the grounding layer and high frequency signal lines. The circuit board is made of polyethylene terephthalate (PET) or polyimide (PI). Alternatively, a rigid board including resin and fibrous material or a rigid-flex board is used. The circuit board can be a single-layer circuit board or a multi-layer board formed by combining at least two single-layer circuit boards. A thickness-expanding pad is mounted between the high frequency signal contact pads and the grounding layer or the thickness of a portion of a bonding layer of the circuit board is increased to provide an expanded thickness.

Description

technical field [0001] The invention relates to a structural design for improving the transmission quality of high-frequency signals on a circuit board, in particular to an anti-attenuation structure for a high-frequency signal connection pad of a circuit board, which has a structure between the connection pad layout section of the substrate and the ground layer -enlarging the thickness to reduce the capacitive effect between the high-frequency signal connection pad and the ground layer, thereby reducing the attenuation effect of the high-frequency signal during transmission. Background technique [0002] In various electronic devices used today, since the amount of data transmitted by signal lines is increasing, the number of signal transmission lines required is not only increasing, but the frequency of transmitting signals is also increasing. [0003] There are many ways to suppress the noise generated by high-frequency signal lines. Modern circuits still use common mode ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11
CPCH05K1/118H05K1/024H05K1/025H05K1/117H05K2201/0191H05K1/0224H05K1/0242H05K1/0366
Inventor 卓志恒苏国富林昆津
Owner ADVANCED FLEXIBLE CIRCUITS
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