Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ultrasonic probe and manufacturing method for ultrasonic probe

A technology of ultrasonic probe and manufacturing method, which is applied in ultrasonic/sonic/infrasonic diagnosis, material analysis by using sound wave/ultrasonic/infrasonic wave, sound wave diagnosis, etc., which can solve the problems of low production efficiency, poor imaging quality and difficulty in mass production of ultrasonic probes and other issues to achieve the effect of increasing process complexity, improving production efficiency, and realizing mass production

Active Publication Date: 2015-05-06
EDAN INSTR
View PDF12 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The object of the present invention is to provide an ultrasonic probe, aiming to solve the problems of low production efficiency, poor imaging quality and difficulty in mass production of the ultrasonic probe in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultrasonic probe and manufacturing method for ultrasonic probe
  • Ultrasonic probe and manufacturing method for ultrasonic probe
  • Ultrasonic probe and manufacturing method for ultrasonic probe

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0029] The implementation of the present invention will be described in detail below in conjunction with specific embodiments.

[0030] like Figure 1-8 Shown is the preferred embodiment provided by the present invention.

[0031] The ultrasonic probe provided in this embodiment includes a piezoelectric chip 101. For the piezoelectric chip 101 of the ultrasonic probe, after being excited by an electric pulse, it will respectively radiate ultrasonic waves outward from the two surfaces of the piezoelectric chip 101. . The surface of the piezoelectric wafer 101 facing the object to be detected is s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of ultrasonic imaging equipment and discloses an ultrasonic probe and a manufacturing method for the ultrasonic probe. The ultrasonic probe comprises a piezoelectric crystal plate, wherein row electrodes are arranged on the front surface of the piezoelectric crystal plate; matching layers are pasted to a plurality of rows of electrodes; each row electrode passes through the side wall of the piezoelectric crystal plate and extends to two sides of the rear surface of the piezoelectric crystal plate to form an edge-covering electrode; column electrodes are arranged on the rear surface of the piezoelectric crystal plate; transverse cutting grooves are formed between adjacent row electrodes; longitudinal cutting grooves are formed between adjacent column electrodes; the edge-covering electrodes and the column electrodes are connected to leads; the leads are connected to a circuit board. The ultrasonic probe is simple in structure; the cost and the process difficulty are reduced; the production efficiency of the ultrasonic probe is improved; the batch production is achieved; the condition that the process difficulty of the ultrasonic probe is additionally increased by the introduction of a conductive component can be avoided; the positions of the leads connected to the edge-covering electrodes and the column electrodes are not located on the ultrasonic propagation path; the reduction of the acoustic performance of the probe caused by the introduction of structures such as an electric connection plate is avoided; the imaging effect of the ultrasonic probe is improved.

Description

technical field [0001] The invention relates to the technical field of ultrasonic imaging equipment, in particular to an ultrasonic probe and a manufacturing method thereof. Background technique [0002] Ultrasound imaging is a widely used detection and diagnosis method, which has the advantages of non-destructive, cheap, convenient and reliable. The ultrasonic signal generated by the ultrasonic probe propagates in the opaque medium, receives information such as the intensity, frequency, time, and phase of the ultrasonic signal reflected in the opaque object, and processes the received signal to obtain the detected signal. A visual image of the distribution of structural acoustic properties inside an opaque medium. [0003] A one-dimensional linear array or convex array ultrasonic probe can be used to obtain a two-dimensional cross-sectional image of the internal structure of the detected object. In order to obtain more clearly visible image details, such as improving the p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): A61B8/00G01N29/24
CPCA61B8/4444
Inventor 周丹王文娟陈露露张欣欣欧阳波
Owner EDAN INSTR
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products