Preparation technology for high-strength high-conductivity copper alloy guide lines

A preparation process and copper alloy technology are applied in the field of preparation technology of high-strength and high-conductivity copper alloy wires, which can solve the problems of poor heat resistance, high price and low strength, and achieve the effects of enhanced strength and wire performance, high strength and low price.

Inactive Publication Date: 2015-05-06
MAANSHAN XINGLONG FOUNDRY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The material of the wire generally requires strong electrical conductivity, high strength, and good heat resistance, but the existing wire materials are generally metal materials, such as copper materials, aluminum materials, or alloy materials with precious metals added, such The material is not only expensive, but also has low strength and poor heat resistance

Method used

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Embodiment Construction

[0015] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further elaborated below in combination with specific methods.

[0016] The high-strength and high-conductivity copper alloy wire preparation process is characterized in that it includes the following steps,

[0017] (1), the particle size is 0.4~0.8 μm and the nanometer refined copper powder that is 16~18 parts by weight and the particle size is 0.2~0.3 μm is 2~4 nanometer refined copper powder and particle size is 0.2~0.6 μm The nano-fine tungsten powder with a weight part of 84-86 is fully mixed and put into a ball mill for ball milling;

[0018] (2), after the ball milling is completed, fill the argon protection zone and dry in the vacuum glove box;

[0019] (3) Extrusion molding, extruding the dried powder raw material under the action of a press to form a wire, and the pressure of the press is set to 500-60...

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PUM

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Abstract

The invention discloses a preparation technology for high-strength high-conductivity copper alloy guide lines, and relates to the technical field of guide line production and processing. The preparation method is characterized by comprising the following steps of (1) fully mixing 16-18 parts by weight of nanometer refined copper powder of which the grain diameter is 0.4-0.8 mum and 2-4 parts by weight of nanometer refined copper powder of which the grain diameter is 0.2-0.3 mum with 84-86 parts by weight of nanometer refined tungsten powder of which the grain diameter is 0.2-0.6 mum, and putting the mixture in a ball grinding mill to carry out ball milling; (2) protecting, distinguishing and drying by filling a vacuum glove box with argon after the ball milling is completed; (3) carrying out extrusion forming, wherein dried powder raw materials can be extruded into guide lines under the action of a press machine, and the pressure of the press machine is set to be 500-600MPa; (4) sintering, wherein sintering forming is carried out on the guide lines which are formed by extrusion forming, and the sintering temperature is controlled to be 900-1000 DEG C. The preparation technology is convenient for large-scale production, is low in price and has very high strength, high conductivity and high temperature-resisting capacity.

Description

Technical field: [0001] The invention relates to the technical field of wire production and processing, in particular to a process for preparing high-strength and high-conductivity copper alloy wires. Background technique: [0002] Wire refers to the material used as wire and cable, and also refers to wire in industry. The material of the wire generally requires the characteristics of strong conductivity, high strength, and good heat resistance, but the existing wire materials are generally metal materials, such as copper materials, aluminum materials, or alloy materials with precious metals added, such The material is not only expensive, but also has low strength and poor heat resistance. Invention content: [0003] The technical problem to be solved by the present invention is to provide a low-cost high-strength and high-conductivity copper alloy wire preparation process. [0004] The technical problem solved adopts the following technical solutions: [0005] The high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/20B22F5/12B22F1/00C22C27/04
Inventor 张家俊
Owner MAANSHAN XINGLONG FOUNDRY CO LTD
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