A tungsten steel and a commutator contact piece measuring device using the tungsten steel
A measuring device and contact piece technology, applied in the direction of measuring devices, mechanical measuring devices, mechanical devices, etc., can solve the problems of inability to measure the angle between the two sides of the contact piece, low measurement accuracy, and inaccurate measurement of the contact piece, etc. Achieve the effects of improving the interface bonding strength, reasonable raw material ratio, and improving molding quality
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0045] First, the raw materials are weighed according to the following formula: 15% of binder metal, 0.3% of rare earth metal, 0.6% of inhibitor and the balance of tungsten carbide. Among them, the binder metal is composed of 92% metallic Co and 8% additive Ni, the inhibitor is vanadium carbide, the rare earth metal is La, and the particle size of all raw materials is less than 0.1 μm.
[0046] The raw materials are then mixed, ground, dried, pressed and sintered. The sintering is divided into three stages: preheating, pre-sintering and sintering. The preheating temperature is 400°C, the holding time is 100min, the pre-sintering temperature is 1260°C, the holding time is 110min, the sintering temperature is 1500°C, and the holding time is 100min. The heating rate of each stage was 8°C / min. In addition, in the final sintering stage, an inert gas needs to be introduced to form a sintering pressure of 6MPa. After sintering, post-treatment is carried out. The post-treatment proc...
Embodiment 2
[0048] First, the raw materials are weighed according to the following formula: 15% of binder metal, 0.3% of rare earth metal, 0.6% of inhibitor and the balance of tungsten carbide. Among them, the binder metal is composed of 92% metal Co and 8% additive Cr, the inhibitor is chromium carbide, the rare earth metal is Ce, and the particle size of all raw materials is less than 0.1 μm.
[0049] The raw materials are then mixed, ground, dried, pressed and sintered. The sintering is divided into three stages: preheating, pre-sintering and sintering. The preheating temperature is 400°C, the holding time is 100min, the pre-sintering temperature is 1260°C, the holding time is 110min, the sintering temperature is 1500°C, and the holding time is 100min. The heating rate of each stage was 8°C / min. In addition, in the final sintering stage, an inert gas needs to be introduced to form a sintering pressure of 8MPa. After sintering, post-treatment is carried out. The post-treatment process...
Embodiment 3
[0051] First, the raw materials are weighed according to the following formula: 15% of binder metal, 0.3% of rare earth metal, 0.6% of inhibitor and the balance of tungsten carbide. Among them, the bonding metal consists of 92% metallic Co and 8% additive Co 3 The composition is Al, the inhibitor is vanadium carbide, the rare earth metal is Nd, and the particle size of all raw materials is less than 0.1 μm.
[0052] The raw materials are then mixed, ground, dried, pressed and sintered. The sintering is divided into three stages: preheating, pre-sintering and sintering. The preheating temperature is 400°C, the holding time is 100min, the pre-sintering temperature is 1260°C, the holding time is 110min, the sintering temperature is 1500°C, and the holding time is 100min. The heating rate of each stage was 8°C / min. In addition, in the final sintering stage, an inert gas needs to be introduced to form a sintering pressure of 6MPa. After sintering, post-treatment is carried out. ...
PUM
Property | Measurement | Unit |
---|---|---|
particle size | aaaaa | aaaaa |
particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com