Connecting wire applied to monolithic microwave integrated circuit and design method of connecting wire

Abstract

The invention relates to the technical field of integrated circuit manufacturing, in particular to a connecting wire applied to a single-chip microwave integrated circuit. The connecting wire comprises a first connecting wire, a capacitor and a second connecting wire, wherein the first connecting wire and the second connecting wire are connected with two sub-circuits respectively, and the capacitor is connected between the first connecting wire and the second connecting wire. Compared with a conventional connecting wire, the connecting wire applied to the single-chip microwave integrated circuit has the advantages that the biggest change is that the capacitor is added between the first connecting wire and the second connecting wire, the transmission line effect of the connecting wire can be counteracted by the capacitor, and the capacitor cannot occupy a too large area, and cannot affect the overall layout of a chip. The connecting wire can be regarded as an ideal connecting wire nearby the working frequency, and cannot affect the performance of the circuit.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to a connecting wire applied to a monolithic microwave integrated circuit and a design method for the connecting wire. Background technique [0002] With the development of microelectronics technology and microwave technology, monolithic microwave integrated circuits are more and more widely used in microwave communication systems. Compared with traditional hybrid integrated circuits, monolithic microwave integrated circuits have the advantages of small size, light weight, low cost, and high consistency. integrated circuit module. This development trend puts forward higher and higher requirements for monolithic microwave integrated circuits, and the demand for multifunctional monolithic microwave integrated circuits with complex structures is getting higher and higher. [0003] The current monolithic microwave integrated circuit chip often contains multipl...

AI Technical Summary

Problems solved by technology

[0009] 1. The 50Ω characteristic impedance transmission line is often used in hybrid microwave integrated circuits, but for monolithic microwave integrated circuits, the width of the 50Ω characteristic impedance transmission line is too large, which will take up a lot of space, thereby increasing the cost of the chip, and the 50Ω characteristic impedance The use of the transmission line is inconvenient for the layout of the chip;

[0010] 2. In the microwave and millimeter wave frequency bands, connecting lines with a length of tens of microns will have a huge impact on the performance of the circuit, and in many cases the length of the connecting lines is more than 100 microns, so even if the length of the connecting lines is reduced To the minimum, it will also have a non-negligible impact on the circuit performance;

[0011] 3. Using the connection line as part of the overall circuit matching can ensure the overall performance of the circuit, but this method means that each sub-circuit needs to be re-optimized, which will undoubtedly take a lot of time

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