Chip fixing device and preparation method for invalid analysis sample

A technology for failure analysis samples and fixtures, which is applied in the semiconductor field, can solve problems such as the inability to realize automatic chemical grinding, and achieve the effects of easy operation, high success rate, and simple methods

Active Publication Date: 2015-05-20
WUHAN XINXIN SEMICON MFG CO LTD
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Problems solved by technology

[0005] The purpose of the present invention is to provide a chip fixing device and a method for preparing failure analysis samples, which can solve the bottleneck that automatic chemical grinding cannot be realized because the samples are too thin, avoid grinding failure caused by uneven strength of hands, and can automatically prepare failure analysis in batches sample

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  • Chip fixing device and preparation method for invalid analysis sample
  • Chip fixing device and preparation method for invalid analysis sample
  • Chip fixing device and preparation method for invalid analysis sample

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Embodiment Construction

[0036] It can be seen from the background technology that during the preparation of the failure analysis sample, it is necessary to face the front of the sample to the chemical grinder table, and manually press the back of the sample to complete the grinding of the sample, thereby preparing the failure analysis sample. The inventor found that in the grinding process, a frictional force opposite to the rotation direction of the chemical grinding machine table will be produced, such as figure 1 A force in the X direction, and a centrifugal force perpendicular to the direction of rotation, such as figure 1 For the force in the Y direction, to ensure the smoothness of the grinding process, it is necessary to apply force from the outside to balance the friction and centrifugal force. In the process of manual grinding, the force applied from the outside is in the direction perpendicular to the chemical grinding machine table. Such as figure 1 The force in the Z direction, the exter...

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Abstract

The invention provides a chip fixing device and a preparation method for an invalid analysis sample. A chip sample is attached to the chip fixing device, anti-friction force and anti-centrifugal force needed in a chemical milling process are provided by fixing the chip sample, automatic chemical milling is achieved, so that automatic batch preparation of the invalid analysis sample is achieved, the pretreatment efficiency of the invalid analysis sample is improved, the success rate of the preparation of the invalid analysis sample is improved, and meanwhile manpower resources are saved; meanwhile, a spring is arranged in a pressure adjusting device, the degree of tightness of the spring can be adjusted through an adjusting valve, so that the pressure applied on a chemical milling platform can be adjusted, the adjustment of chemical milling speed is achieved, and the efficiency of the chemical milling is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chip fixing device and a method for preparing samples for failure analysis. Background technique [0002] The existing laboratory failure analysis sample preparation pretreatment basically uses manual polishing (polish) to a predetermined layer. Generally speaking, the basic size of the sample used in the failure analysis sample preparation process in the laboratory is less than 5mm*15mm, and the thickness is less than 2mm; during the failure analysis sample preparation process, the front of the sample needs to face the chemical grinding machine (PAD) , and then press the back of the sample by hand to complete the grinding. Only one failure analysis sample can be prepared at a time. [0003] Problems existing in the existing manual method: 1) Inefficiency, especially for logic products with many back-end metal layers, the pretreatment of sample preparation needs to poli...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/30B24B37/10G01N1/32
CPCB24B37/10B24B37/30G01N1/32
Inventor 黄雪青
Owner WUHAN XINXIN SEMICON MFG CO LTD
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