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Liquid resin composition for electronic component and electronic component device

A technology of resin composition and electronic components, which is applied in the direction of electrical components, electric solid devices, semiconductor/solid device parts, etc., can solve the problems that the high purity of liquid resin composition is difficult to adapt, and achieve low water absorption rate, glue Good viscosity and good migration resistance

Active Publication Date: 2015-05-20
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for example, in COF (Chip On Film), which is a typical semiconductor device with remarkable line thinning and narrow pitch, further improvement of migration resistance is required, and it is difficult to achieve high purity of the liquid resin composition for electronic parts only. adapt

Method used

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  • Liquid resin composition for electronic component and electronic component device
  • Liquid resin composition for electronic component and electronic component device
  • Liquid resin composition for electronic component and electronic component device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～5

[0110] (Examples 1 to 5 and Comparative Example)

[0111] (A) as epoxy resin

[0112] Bisphenol F type liquid epoxy resin with an epoxy equivalent of 160 (trade name YDF-8170C manufactured by Tohto Chemical Co., Ltd.),

[0113] Naphthalene-type epoxy resin with an epoxy equivalent of 140 (trade name HP-4032 manufactured by Dainippon Ink Industry Co., Ltd.),

[0114] as a rubber particle component

[0115] Make acrylonitrile-butadiene-methacrylic acid-divinylbenzene copolymer (trade name XER-91P manufactured by JSR Corporation) in bisphenol F type liquid epoxy resin (YDF-8170C) at a mass ratio of 1 / 4 The rubber-modified epoxy resin that has been heat-miscible and micro-dispersed in advance,

[0116] as leveling agent

[0117] Phenol-modified silicone with a hydroxyl equivalent of 750 (trade name BY16-799 manufactured by Toray Dow Corning Silicone Co., Ltd.) and bisphenol F-type liquid epoxy resin (YDF-8170C) are heated and mixed at a mass ratio of 1 / 1 The obtained silicon...

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Abstract

The invention provides a liquid resin composition and an electronic component sealed by the liquid resin composition. The liquid resin composition has a good anti-mobility, excellent shaping ability and reliability. The liquid resin composition includes (A) epoxy resin, (B) liquid cyclic anhydride at room temperature, (C) coupling agent and (D) antioxidant of liquid resin composition for electronic component.

Description

[0001] This application is a divisional application of the application number 201310012783.0 and the title of the invention "Liquid resin composition for electronic components and electronic component device" submitted by the applicant. The filing date of the parent case is March 30, 2010. technical field [0002] The present invention relates to a liquid resin composition for electronic components suitable for sealing electronic components, and an electronic component device sealed by the same. Background technique [0003] Currently, in the field of element sealing for electronic component devices such as transistors and ICs, resin sealing has become the mainstream from the viewpoints of productivity and cost, and epoxy resin compositions have been widely used. The reason for this is that epoxy resins are balanced in properties such as handleability, moldability, electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesiveness to inserts...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08K13/02C08K5/5435C08K5/13C08K5/134C08K5/17C08K5/3445C08K3/36C08G59/42H01L23/29
Inventor 高桥寿登太田浩司
Owner RESONAC CORPORATION