Temperature monitoring device and plasma processing apparatus

Abstract

The invention provides a temperature monitoring device and a plasma processing apparatus. In the temperature monitoring device, a drive unit driving temperature detection module moves in a reaction chamber to make the temperature detection module detect the temperatures of different areas of a heated body in the movement process and send the detected temperatures to a control unit; and the control unit compares the temperatures sent by the temperature detection module with a preset standard temperature, and a calibration heating unit outputs power to the detected areas corresponding to the temperatures sent by the temperature detection module when a deviation exists between the temperatures and the preset standard temperature. The temperature monitoring device provided by the invention can improve the heating uniformity of the heated body in order to improve the process quality, and can simplify the operation process in order to improve the work efficiency.

Description

technical field [0001] The invention belongs to the field of semiconductor equipment manufacturing, and in particular relates to a temperature monitoring device and plasma processing equipment. Background technique [0002] In the process of using PVD equipment for degassing process in the field of semiconductor integrated circuit manufacturing and in the process of preheating process before coating with ITO PVD equipment in the field of LED manufacturing, heating bulbs are usually used to heat the workpiece to the required level of the process. The temperature, and the temperature uniformity of the processed process is an important factor affecting the quality of its subsequent process. [0003] figure 1 For a schematic diagram of an existing degassing chamber, see figure 1 , the degassing chamber 10 is horizontally provided with a quartz window 17 to divide the degassing chamber 10 from top to bottom into an upper chamber 18 and a lower chamber 19, wherein the bottom of ...

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Problems solved by technology

[0006] First, since the actual heating temperature of the processed workpiece will be affected when the process environment of the degassing chamber changes or the material of the processed workpiece changes, it is difficult to realize the processing of the processed workpiece with the test data as a

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