Method for preparing film layer pattern, thin film transistor and array substrate

Abstract

The embodiment of the invention provides a method for preparing a film layer pattern, a thin film transistor and an array substrate, which relates to the technical field of display, and has the advantages that the product yield can be effectively improved, the manufacturing cycle can be shortened, and the cost is saved. The method for preparing the film layer pattern comprises the following steps: providing a mask plate, wherein the mask plate comprises a mask plate body and a hollow part arranged on the mask plate body; arranging the mask plate on a substrate so as to enable the projection of the hollow part on the substrate to be coincided with the projection of a to-be-formed film layer pattern on the substrate; forming a film on the substrate on which the mask plate is arranged; separating the film formed on the hollow part from the film formed on the mask plate body; and stripping the mask plate, and forming the film layer pattern. The method is used for manufacturing the thin film transistor, the array substrate and a display device comprising the array substrate.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for preparing a thin film layer pattern, a thin film transistor and an array substrate. Background technique [0002] At present, taking thin-film transistors as an example, the gate, semiconductor active layer, source and drain are prepared by first defining the pattern of the photoresist through the yellow light process, and then the etching process will not be covered by the photoresist. The thin film is etched away to obtain the desired pattern; among them, the yellow light process includes photoresist coating, exposure, and development. [0003] However, with the improvement of product resolution, the requirements for the stability of the production equipment are getting higher and higher when making the corresponding patterns through the yellow light process, especially the yellow light and etching equipment. If the conditions of these two equipment are unstable ...

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Problems solved by technology

[0003] However, with the improvement of product resolution, the requirements for the stability of the production equipment are getting higher and higher when making the corresponding patterns through the yellow light process, especially the yellow light and etching equipment. If the conditions of these two equipment are unstable Or poor, it is easy to cause photoresist residue or poor etching, so that the formed patterns of each layer have defects. Among them, when the formed pattern is a conductive pattern, for example, there will be a short circuit or an open circuit.

[0004] In addition, since the preparation of the corresponding patterns in the prior art requires both the yellow light process and the etching process, and the yellow light process also includes the coating, exposure and development of the photoresist, the production process takes a long time, and it is easy to increase the yield rate. risks and uncertainties, and the use of traditional photoresists and etching-related chemicals is not conducive to the reduction of production costs

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