Novel pressure tube type IGBT water cooling plate

Abstract

The invention provides a novel pressure tube type IGBT water cooling plate. An IGBT element is mounted on the upper surface of the novel pressure tube type IGBT water cooling plate, and a certain amount of electrical components and control circuits are cooperatively used; an improved S-shaped flow passage is embedded in the interior of the water cooling plate, and the improved S-shaped flow passage enables a copper tube to be exposed and on the same plane as the water cooling plate through surface working; a spring piece turbulent flow device is mounted in the improved S-shaped flow passage; a water inlet of the improved S-shaped flow passage is formed in the outer side of the water cooling plate; a water outlet of the improved S-shaped flow passage is formed in the inner side of the water cooling plate. The novel pressure tube type IGBT water cooling plate provided by the invention can effectively avoid bubble and waterway dead zones; inlet and outlet flow passages of the improved S-shaped flow passage are arranged in a staggered mode, the heat dissipation performance is higher, the thermal homogeneity is higher, and the pressure difference of the inlet and the outlet is little; the novel pressure tube type IGBT water cooling plate has the characteristics of simple manufacturing technology, short working time, low cost, high thermal homogeneity, efficient heat dissipation and the like.

Description

Technical field: [0001] The invention relates to a heat dissipation device for a power unit device, in particular to the technical field of a novel pressure tube type IGBT water-cooled plate radiator. Background technique: [0002] With the development of electrical equipment in the direction of high power density and miniaturization, the heat flux density of components and components continues to increase, and thermal design is also facing severe challenges. Among the common failures of electrical and electronic equipment, the proportion of equipment not working properly due to excessive temperature of electronic equipment accounts for more than half. The loss of power components such as IGBT has reached tens of kilowatts in a limited space. However, it is difficult to meet the needs of high-loss power components by using the traditional air-cooled type. Water-cooled heat dissipation technology is gradually replacing air-cooled heat dissipation. Driven by the pump, the for...

AI Technical Summary

Problems solved by technology

However, the design of the flow channel with different structures causes problems such as uneven distribution of the flow channel and excessive pressure difference of the flow channel.

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