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Preparation method for micro/nanostructure epoxy composite insulating material for GIS

A technology of micro-nano structure and composite insulation, which is applied in the preparation of epoxy resin composite materials and the preparation of micro-nano structure epoxy composite insulation materials for GIS, can solve the problems that restrict the development of micro-nano epoxy resin composite materials, and achieve Excellent thermal stability, improved dispersion performance, and excellent mechanical properties

Active Publication Date: 2015-06-10
XI AN JIAOTONG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the dispersion of micro-nano fillers restricts the further development of micro-nano epoxy resin composites

Method used

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  • Preparation method for micro/nanostructure epoxy composite insulating material for GIS
  • Preparation method for micro/nanostructure epoxy composite insulating material for GIS
  • Preparation method for micro/nanostructure epoxy composite insulating material for GIS

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] 1) Modification and dispersion of filler particles

[0024] Nano Al 2 o 3 Add the particles into the acid anhydride curing agent methyltetrahydrophthalic anhydride (MeTHPA), then add the silane coupling agent KH550, first stir evenly with a glass rod, then use the rotation revolution mixer, first rotate at the speed of 1000r / min for 10min, and then Rotate at a rotational speed of 2000r / min for 5min, and disperse to obtain a mixture. The obtained mixture was ultrasonically dispersed in an ice bath at 0° C., and the total time of ultrasonic dispersion was 45 min, wherein the ultrasonic time was 1 s, the ultrasonic interval was 1 s, and the ultrasonic power was 500 W. At this time, nano-Al 2 o 3 The particles are evenly dispersed, resulting in a well-dispersed mixture.

[0025] Add bisphenol A type glycidyl ether epoxy resin, micron Al 2 o 3 and accelerator dimethylbenzylamine (BDMA), first stir with a glass rod, then use a rotation revolution mixer, first rotate at...

Embodiment 2

[0030] 1) Modification and dispersion of filler particles

[0031] Nano TiO 2Add the particles into the acid anhydride curing agent methyltetrahydrophthalic anhydride (MeTHPA), then add the silane coupling agent KH550, first stir evenly with a glass rod, then use the rotation revolution mixer, first rotate at the speed of 1000r / min for 10min, and then Rotate at a rotational speed of 2000r / min for 5min, and disperse to obtain a mixture. The obtained mixture was ultrasonically dispersed in an ice bath at 0° C., and the total time of ultrasonic dispersion was 45 min, wherein the ultrasonic time was 1 s, the ultrasonic interval was 1 s, and the ultrasonic power was 500 W. At this time, the nano-TiO 2 The particles are evenly dispersed, resulting in a well-dispersed mixture.

[0032] Add bisphenol A type glycidyl ether epoxy resin, micron Al 2 o 3 and accelerator dimethylbenzylamine (BDMA), first stir with a glass rod, then use a rotation revolution mixer, first rotate at a sp...

Embodiment 3

[0037] 1) Modification and dispersion of filler particles

[0038] Nano Al 2 o 3 Add the particles into the acid anhydride curing agent methyltetrahydrophthalic anhydride (MeTHPA), then add the silane coupling agent KH550, first stir evenly with a glass rod, then use the rotation revolution mixer, first rotate at a speed of 500r / min for 15min, and then Rotate at a rotational speed of 1000r / min for 10min, and disperse to obtain a mixture. The obtained mixture was ultrasonically dispersed in an ice bath at 0° C., and the total time of ultrasonic dispersion was 30 min, wherein the ultrasonic time was 1 s, the ultrasonic interval was 1 s, and the ultrasonic power was 600 W. At this time, nano-Al 2 o 3 The particles are evenly dispersed, resulting in a well-dispersed mixture.

[0039] Add bisphenol A type glycidyl ether epoxy resin, micron Al 2 o 3 and accelerator dimethylbenzylamine (BDMA), first stir with a glass rod, and then use a rotation-revolving mixer, first rotate a...

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Abstract

The invention discloses a preparation method for micro / nanostructure epoxy composite insulating material for GIS. The preparation method for the micro / nanostructure epoxy composite insulating material for the GIS uses the epoxy resin which is excellent in insulating property, thermal property and mechanical property and broadly used for the industrial field as base body and uses micrometer Al2O3 and nano-Al2O3 or TiO2 particles as composite padding, and moreover, chemical bonding is formed between the inorganic Al2O3 and TiO2 particles and the organic epoxy resin through performing coupling modification on the nano-Al2O3 and nano-TiO2 surfaces to lead in silicon oxygen bond, and meanwhile, the dispersing performance of the Al2O3 and TiO2 in the epoxy resin is improved. The preparation method for the micro / nanostructure epoxy composite insulating material for the GIS is capable of overcoming the influence of the micro and nano particles aggregation of the prior art to the breakdown property and dielectric property of the epoxy resin. The micro / nanostructure epoxy composite insulating material for the GIS prepared by the method has excellent thermal stability, breakdown property and dielectric property.

Description

technical field [0001] The invention belongs to the field of insulating materials, and relates to a preparation method of an epoxy resin composite material, in particular to a preparation method of a micro-nano structure epoxy composite insulating material for GIS. Background technique [0002] Epoxy resin is a thermosetting resin with excellent mechanical, insulating and bonding properties, widely used in manufacturing and high-tech fields such as electrical and electronic material packaging, coatings, adhesives, electrical and electronic switches and power equipment. Especially in power equipment, with the wide application of epoxy materials in GIS solid insulation, higher and higher requirements are put forward for the thermal stability and AC breakdown characteristics of epoxy composite materials. The nanofiller (Al 2 o 3 , SiO 2 、TiO 2 , MgO, ZnO, montmorillonite, etc.) and the polymer matrix processed by chemical modification method can effectively improve the elec...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/06C08K3/22
Inventor 陈玉郭洁琳邵志辉成永红邬捷龙
Owner XI AN JIAOTONG UNIV