A Multilayer Matrix Compression Method for Analyzing Mutual Coupling of Microstrip Package Interconnects

Abstract

The invention discloses a multi-layer matrix compression method for analyzing the mutual coupling of microstrip packaging interconnection lines. The steps are: extract the grid file of microstrip packaged interconnection lines, mark the interconnection line ports of mutual coupling; perform octree grouping on the analyzed interconnection line grid according to the number of discrete edges in the finest layer group, and group The distance between the centers divides the near-field action area and the far-field action area of ​​each group containing discrete edges; establishes the mixed potential integral equation and the right excitation vector corresponding to the interconnection line feed, and for the dense matrix generated by the integral equation discretization, The moment method is used in the near-field action area, and the multi-layer matrix compression method is used in the far-field action area; the current coefficient of the equation is determined by the GMRES iteration method of ILU preconditioning, and the relationship between the interconnection lines is solved according to the marked interconnection lines. coupling. The method of the invention has the advantages of less memory consumption and high efficiency, and realizes fast and effective estimation of the mutual coupling of the entire microstrip packaging interconnection line.

Description

technical field [0001] The invention relates to the technical field of electromagnetic simulation, in particular to a multilevel matrix compression method (Multilevel Matrix Compression Method, MLMCM) for analyzing the mutual coupling of microstrip packaging interconnection lines. Background technique [0002] Integrated circuits have become an important pillar for the current development of various high-tech weapons, and have been widely used in various advanced tactical missiles, electronic warfare, communication systems, land, sea and air-based various advanced phased array radars (especially airborne and satellite Carrier radar), has formed a huge market that is developing rapidly in terms of civil and commercial mobile phones, wireless communications, personal satellite communication networks, global positioning systems, direct broadcast satellite reception, and millimeter-wave automatic collision avoidance systems. In the IT industry, there is the well-known Moore's La...

AI Technical Summary

Problems solved by technology

However, existing low-rank compression methods based on matrix factorization such as IES 3 , H matrix, adaptive cross approximation, multi-level UV method (Multilevel UV, MLUV), etc., the low-rank compression decomposition approximation matrices U and V are related to the current non-empty group and the corresponding far-field action group, so that the low-rank compression The decomposition process consumes a lot of time and memory

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