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Preparation method for LED packaging cover plate

A technology of LED packaging and cover plate, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of glass overflow, touching chips and wires, affecting the luminous effect, etc., to improve the bonding force, improve the luminous performance and life, product good consistency

Inactive Publication Date: 2015-06-24
CHAOZHOU THREE CIRCLE GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the above-mentioned problems in the prior art, the present invention provides a method for preparing an LED packaging cover plate, which solves the problem that glass easily overflows from the metal base plate due to high-temperature melting in the existing LED inorganic packaging technology, and touches chips and Wire, the problem that affects the lighting effect

Method used

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  • Preparation method for LED packaging cover plate
  • Preparation method for LED packaging cover plate
  • Preparation method for LED packaging cover plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] An embodiment of the preparation method of the LED packaging cover plate of the present invention, the preparation method includes the following steps:

[0037] (1) Process the metal parts into such as figure 1 the shape shown, and then make it size and performance as required;

[0038] Metal parts size: the diameter of the inner hole is 2.4±0.03mm, the diameter of the step 3 is 2.8±0.03mm, and the side length of the cover plate is 4.3±0.05mm;

[0039] (2) Make SCHOTT 8250 glass lenses of the following sizes and shapes;

[0040] Shape: glass cube;

[0041] Dimensions: length (1.84±0.02mm)×width (1.84±0.02mm)×height (1.60±0.02mm);

[0042] (3) Decontamination and cleaning of the metal parts and the Schott 8250 glass lens made, and then drying;

[0043] Metal parts: Ultrasonic cleaning with degreasing powder for 30 minutes;

[0044]SCHOTT 8250 glass lens: Ultrasonic cleaning with absolute ethanol for 30 minutes;

[0045] After metal parts and glass lenses are cleane...

Embodiment 2

[0053] An embodiment of the preparation method of the LED packaging cover plate of the present invention, the preparation method includes the following steps:

[0054] (1) Process the metal parts into such as figure 2 the shape shown, and then make it size and performance as required;

[0055] Metal parts size: the inner hole diameter is 2.4±0.03mm, the diameter of the protrusion 4 is 2.8±0.03mm, and the side length of the cover plate is 4.3±0.05mm;

[0056] (2) Make DM-305 glass lenses of the following sizes and shapes;

[0057] Shape: round flake

[0058] Dimensions: diameter (2.6±0.02mm)×thickness (1.1±0.02mm)

[0059] (3) the metal parts and DM-305 glass lenses made are decontaminated and cleaned, and then dried;

[0060] Metal parts: Ultrasonic cleaning with degreasing powder for 20 minutes;

[0061] DM-305 glass lens: Ultrasonic cleaning with absolute ethanol for 20 minutes;

[0062] After metal parts and glass lenses are cleaned, dry them in a drying oven at 120°...

Embodiment 3

[0070] An embodiment of the preparation method of the LED packaging cover plate of the present invention, the preparation method includes the following steps:

[0071] (1) Process the metal parts into such as image 3 The shape shown, so that its dimensions and performance meet the requirements;

[0072] Metal parts size: the inner hole diameter is 2.4±0.03mm, the diameter of the protrusion 4 is 2.8±0.03mm, and the side length of the cover plate is 4.3±0.05mm;

[0073] (2) Make Corning 7056 glass lenses of the following sizes and shapes;

[0074] Shape: round flake

[0075] Dimensions: diameter (2.6±0.02mm)×thickness (1.1±0.02mm)

[0076] (3) the metal parts and Corning 7056 glass lenses made are decontaminated and cleaned, and then dried;

[0077] Metal parts: Ultrasonic cleaning with degreasing powder for 25 minutes;

[0078] Corning 7056 glass lens: Ultrasonic cleaning with absolute ethanol for 25 minutes;

[0079] After metal parts and glass lenses are cleaned, dry t...

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Abstract

The invention discloses a preparation method for an LED packaging cover plate. According to the preparation method, the curvature of a glass lens is controlled by adjusting glass lens-metal piece sealing sintering furnace atmospheres to enable the spreading direction and the size of the glass lens to be controllable after the glass lens melts at a high temperature, and special materials and chemicals are adopted as a base plate to be embedded into the bottom of a metal piece, so that the flatness of the bottom surface of the cover plate is improved. Compared with the prior art, good air tightness sealing is achieved, a service life of devices is prolonged, and the light emitting effect is improved. The preparation method for the LED packaging cover plate has the advantages that the cost is low and the technology is simple.

Description

technical field [0001] The invention relates to an LED package cover plate, in particular to a preparation method of an LED inorganic package cover plate. Background technique [0002] At present, most LED packages use organic materials such as silica gel and epoxy resin to seal and protect the chip. These materials have good transparency, are easy to operate, and can increase the amount of light output, but they have poor UV resistance and are prone to aging and deterioration in ultraviolet environments. , the amount of light extracted gradually decreases, leading to device failure. Through practical and theoretical verification, organic materials are not conducive to packaging ultraviolet LED devices and devices that are not suitable for using organic materials. Therefore, a simple inorganic packaging process that is resistant to ultraviolet aging and its supporting Parts are very important. In the existing process of preparing inorganic packaging cover plates, the glass ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/00
CPCH01L33/005H01L33/48H01L2933/005
Inventor 邱基华陈剑锋
Owner CHAOZHOU THREE CIRCLE GRP
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