Improved activation liquor for PCB and production technology for generating conductive polymer films in through hole and blind hole of PCB

A production process and technology of activation solution, applied in the direction of electrical connection formation and coating of printed components, can solve the problems of unsuitable PCB soft board, high temperature, and high equipment cost, and achieve lower energy consumption, lower activation temperature, and lower energy consumption. consumption and equipment cost

Active Publication Date: 2015-07-01
GUANGDONG SKYCHEM TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The temperature of the activation treatment in the prior art is relatively high, which is not suitable for the production of PCB soft boards. At the same time, the activation solution has strong oxidative properties, and the activation tank must be made of materials that can withstand high temperature and strong oxidation, such as 316 stainless steel, resulting in High equipment cost

Method used

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  • Improved activation liquor for PCB and production technology for generating conductive polymer films in through hole and blind hole of PCB
  • Improved activation liquor for PCB and production technology for generating conductive polymer films in through hole and blind hole of PCB
  • Improved activation liquor for PCB and production technology for generating conductive polymer films in through hole and blind hole of PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Rigid plate vertical line Generates a polymer conductive film in a through-hole with a diameter of 250 μm and a depth of 1.6 mm.

[0050] The formula of the improved activating solution is as follows:

[0051]

[0052] The film-forming solution formula is as follows:

[0053]

[0054] Place the PCB in 35mL / L H 2 SO 4 (50% w / w) and 90g / L NaPS, keep warm at 30°C for 1min, and wash with water; then place the PCB in 65mL / L adjustment solution SkyPoly 391C, keep warm at 62°C for 2min, and wash with water; then put the PCB Put it in the activation tank, add the above-mentioned improved activation solution according to the proportion, adjust the pH of the improved activation solution to 6.5 with boric acid, control the temperature of the activation tank at 70°C, keep it warm for 3 minutes, wash with water, and form a manganese dioxide film on the surface of the PCB; Finally, place the PCB in the mixture of the above-mentioned film-forming solutions SkyPoly 396A, SkyPo...

Embodiment 2

[0059] Horizontal line of hard board The production process of the present invention is used to generate a polymer conductive film in a through hole with a diameter of 250 μm and a thickness of 2.4 mm.

[0060] The formula of the improved activating solution is as follows:

[0061] SkyPoly 393C 110m L / L

[0062] Ferrous sulfate 5g / L

[0063] Deionized water balance

[0064] The film-forming solution formula is as follows:

[0065]

[0066] Place the PCB in 35mL / L H 2 SO 4(50% w / w) and 90g / L NaPS, keep warm at 30°C for 1min, and wash with water; then place the PCB in 65mL / L adjustment solution SkyPoly 391C, keep warm at 60°C for 1min, and wash with water; then put the PCB Put it in the activation tank, add the above-mentioned improved activation solution according to the proportion, adjust the pH of the improved activation solution to 6 with sulfuric acid, control the temperature of the activation tank to 65°C, keep it warm for 80s, wash with water, and form a manganese...

Embodiment 3

[0070] Horizontal line of hard board The production process of the present invention is used to produce a polymer conductive film in blind holes with a diameter of 100 μm and a depth of 100 μm.

[0071] The formula of the improved activating solution is as follows:

[0072]

[0073] The film-forming solution formula is as follows:

[0074]

[0075] Place the PCB in 35mL / L H 2 SO 4 (50% w / w) and 90g / L NaPS, keep warm at 30°C for 1min, and wash with water; then place the PCB in the adjustment solution SkyPoly 391C, keep warm at 60°C for 3min, and wash with water; then place the PCB in the activation In the tank, add the above-mentioned improved activation solution according to the proportion, adjust the pH of the improved activation solution to 6.5 with phosphoric acid, control the temperature of the activation tank to 75°C, keep it warm for 1min, wash with water, and form a manganese dioxide film on the surface of the PCB; finally the PCB Put it in the mixed solution o...

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Abstract

The invention discloses improved activation liquor for a PCB. The improved activation liquor for the PCB comprises 1-100g/L of a compound or a mixture containing permanganic acid radical ions, 0.1-20g/L of a compound or a mixture containing at least one of ferrous ion, ferric ion and ammonium ion and the balance of deionized water. The improved activation liquor for the PCB contains one or at least two of ferrous ion, ferric ion and ammonium ion, so that an activation reaction can be carried out at low temperature, and energy consumption is reduced compared with the traditional technological conditions; meanwhile, activating treatment requirements of a hard board and a flexible board can be met at the same time, and the problems that an activation tank needs to be prepared from a high-temperature-resistant and strong-oxidation-resistant material as the traditional activation liquor has strong oxidizing property and equipment cost is high can be solved. The activation liquor is improved, so that the energy consumption is reduced, the equipment cost is reduced, and product application range is expanded.

Description

technical field [0001] The invention belongs to the field of PCB production, and in particular relates to an improved activation solution for PCB and a production process for generating polymer conductive films in PCB through holes and blind holes. Background technique [0002] PCB is a component commonly required by various electronic devices in the information society. When establishing an electrical connection between different layers of a multilayer circuit board on a PCB, it usually requires a certain amount of pretreatment to make the surface of the resin and glass filaments between the layers conductive, and further form a thick layer of copper by electroplating, thereby Makes electrical connections between different layers on a circuit board. At present, the common techniques for generating conductivity in through holes or blind holes of circuit boards include electroless thin copper plating method and conductive polymer method. [0003] The electroless thin copper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D1/00H05K3/42C08J5/18
Inventor 章晓冬刘江波
Owner GUANGDONG SKYCHEM TECH LTD
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