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Flexible circuit board and manufacturing method thereof

A circuit board and flexible technology, which is applied in the direction of printed circuit, printed circuit dielectric, circuit optical components, etc., can solve the problem of flexible circuit board thickness, increase the thickness of flexible circuit board, and cannot adapt to the thinning and thinning of mobile phones Requirements and other issues to achieve the effect of reducing the thickness and reducing the overall thickness

Active Publication Date: 2017-11-28
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, the copper thickness of the NFC coil is up to 2 oz (about 70 microns), that is, the circuit of the flexible circuit board is a high-segment line, so it is necessary to select a CVL with a thicker adhesive layer so that the adhesive layer can be completely Fill the gap between the lines of the NFC coil, but because the CVL is pressed on the line and the line gap of the NFC coil at the same time, a thicker CVL will inevitably increase the thickness of the line area of ​​​​the NFC coil of the flexible circuit board, Furthermore, the overall thickness of the flexible circuit board is relatively thick, which inevitably cannot meet the requirements of increasingly thinner and lighter mobile phones.

Method used

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  • Flexible circuit board and manufacturing method thereof
  • Flexible circuit board and manufacturing method thereof
  • Flexible circuit board and manufacturing method thereof

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Embodiment Construction

[0020] The flexible circuit board manufacturing method provided by this technical solution includes the following steps:

[0021] For a first step, see figure 1 , providing a copper clad substrate 100 .

[0022] The copper clad substrate 100 includes a first copper foil 12 , an insulating layer 13 and a second copper foil 14 . Wherein, the insulating layer 13 is bonded between the first copper foil 12 and the second copper foil 14 .

[0023] In this embodiment, the thickness of the first copper foil 12 and the second copper foil 14 is 2 oz. Wherein, the thickness may be the original thickness of the copper foil, or the thickness of the copper foil thickened by electroplating.

[0024] The insulating layer 13 is made of flexible insulating materials such as polyimide, polyethylene and polycarbonate.

[0025] In this embodiment, a double-sided flexible circuit board will be obtained; of course, in other embodiments, the copper-clad substrate 100 may only include the first co...

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PUM

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Abstract

A flexible circuit board, comprising an insulating layer and a conductive circuit pattern formed on the surface of the insulating layer, a circuit gap is formed between the conductive circuit patterns, and a resin layer is formed in the circuit gap, and the flexible The circuit board also includes a cover film, the cover film covers the conductive circuit pattern and the resin layer, and the flexible circuit board is used for near field communication. The invention also provides a method for manufacturing the flexible circuit board.

Description

technical field [0001] The invention relates to a flexible circuit board and a manufacturing method thereof. Background technique [0002] Near Field Communication (NFC) is a new standardized short-range wireless communication technology. It uses the principle of magnetic field induction to enable electronic devices to realize interconnection within a short distance. Based on RFID technology, NFC provides an identification protocol medium for reliable data transmission. Through NFC, users can conduct intuitive, secure, contactless transactions, read information, and connect with other electronic devices through simple contact or proximity. [0003] At present, NFC technology has been widely used in communication devices such as mobile phones. In mobile phones, the short-distance interconnection between mobile phones and other devices can be realized by adding a flexible circuit board, wherein one of the flexible circuit boards Coil-shaped conductive lines (NFC coils) are ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40H05K1/11
CPCH05K1/11H05K3/40H05K1/0274H05K1/0393H05K1/165H05K2201/0108G03F7/20
Inventor 何明展胡先钦沈芾云王之恬
Owner AVARY HLDG (SHENZHEN) CO LTD
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