Acid copper direct-electroplating solution for iron part

Abstract

The invention discloses an acid copper direct-electroplating solution for an iron part. The acid copper direct-electroplating solution contains a basic solution capable of providing cupric ions, a complexing agent, a corrosion inhibitor and a reducing agent, wherein the complexing agent is one or more of tartaric acid, citric acid, etidronic acid and ethylenediaminetetramethylene phosphoric acid; the corrosion inhibitor is thiourea and / or allylthiourea; the reducing agent is formaldehyde and / or glyoxylic acid. The acid copper direct-electroplating solution for the iron part is free of a harmful substance cyanide for copper pre-plating, a copper pre-plating procedure is eliminated, and the iron part can directly be electroplated with copper to form a copper-plated layer which is strong in bonding strength, bright and compact on the surface of the iron part; moreover, compared with an iron substrate easily corroded by high-concentration sulfuric acid in a bright acid copper plating solution, the corrosion inhibitor of the acid copper direct-electroplating solution has the advantages that the iron part can be well protected, the iron part is prevented from being greatly corroded, and the influence on the dimensional accuracy of the iron part is eliminated.

Description

technical field [0001] The invention belongs to the field of electroplating, and in particular relates to a direct copper electroplating solution for iron parts. Background technique [0002] Generally, in copper sulfate (CuSO 4 ·5H 2 O) 160~220g / L, sulfuric acid (H 2 SO 4 98%) 60~80g / L, hydrochloric acid (HCl 36%) 30~120mg / L solution can obtain bright and good leveling copper plating, also known as bright acid copper plating. [0003] Since the bright acidic copper plating solution contains sulfuric acid (H 2 SO 4 98%) is higher, and the higher acidity is more corrosive to the iron substrate; under acidic conditions, copper ions are easily replaced, and a replacement copper layer is formed on the surface of the iron substrate, and the binding force between the replacement copper layer and the iron substrate is extremely poor, so Acceptable copper deposits cannot be obtained in bright acidic copper solutions without preplating. [0004] Iron parts must be pre-plated...

AI Technical Summary

Problems solved by technology

[0012] The purpose of the present invention is to overcome the health and cumbersome problems caused by the pretreatment of harmful substances cyanide in the prior art for electroplating iron parts, and to provide a method that does not contain harmful substances to the human body and the environment and can be obtained on the iron-based surface. Iron parts with good bonding force, bright and dense copper plating layer are directly electroplated with acid copper solution